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... epoxy encapsulant compound. It is design for potting of capacitors and electrical devices. TIE280-12AB-Series-Datasheet (1).pdf Features > Good th...

... Material Epoxy Resin Potting Compound adhesive Gel Low Resistance TIETM380-45 is a one component, heatcu...

..., long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices. Features > Good thermal ...

... Silicone Encapsulant Usage Temperature -40℃ ~ 150 ℃ Attribute Value Test Method Composition Ceramic filler + Silicone - Color/...

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...not only a basis for evaluating the characteristics of materials, but also a design basis for materials in application. This parameter must...

... Grease power module sealant with low oil bleed and low VOC SGH132 grease is a paste-like interface ma...

... Potting Compound 1 1 Mix Ratio for Capacitors and Electrical Devices Product Description: Product Summary: The Thermal Conduct...

... and transfer are desired. Its unique grain-oriented, plate-like structure provides a high conductivity of 240 W/mK in the XY plane...

...pdf 8658G Two-Component Polyurethane Structural Adhesive Two-component polyurethane structural bonding adhesive has high bonding...

... Silicone Pad is made of silicone, a durable material that can withstand high temperatures and harsh environmental conditions. Wi...

2K Dosing System 2 Component Ab Mixing Dispensing Machine Epoxy Silicone Compound Potting Machine Potting is a method for process...

... dispenser High quality double-liquid desktop silicone dispenser robot Specifications : Model :YSATM-3L 1. For Silicone , UV , ab ,...

... Silicon Pad For Heat Dissipation pad is also known as silicone gap filler, therm...

... material compounded with filler. It is through a special formula and process, the polymer silicone and excellent thermal cond...

... Resistant Epoxy Resin Potting And Casting Quick Detail: Name Epoxy Resin AR88 Usage Electronic Components Mixing Ratio A: B =1:1 ...

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... versus deflection characteristics. The combination will allow minimal stress on components while also yielding low resistance. As a result...