semiconductor substrate

... Indium Arsenide InAs wafer Application Indium Arsenide (InAs) single crystal are materials with unique properti...

... High Crystal Quality For Demanding Power Electronics, 4H-N 8inch TANKBLUE Brand Substrate SIC Silicon Carbide Wafer For...

Application:Semi Package,,IC package,IC ,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.L...

... thermal conductivity Aluminum Nitride (AIN) ceramic, this offers exceptional thermal management and electrical insulation properties, ma...

Strain Gauge Transducer SPD High Speed Bending Plate Scales Strain Gauges SPD strain gauge (in the ...

... and carbon with chemical formula SiC. SiC is used in electronics devices that operate at high temperatures or high voltages, or both...

... ceramic ; 2. The thermal expansion coefficient (3.1×10-6/℃) matches the silicon material (3.5-4.0×10-6/℃); 3. The bending s...

... lamp durable, it must be equipped with reliable and robust components. With our molybdenum, MoCu and WCu wafer , LED chips can easily re...

... With the continuous advancement of electronic technology, the demand for high-performance materials keeps rising. Transparent a...

... For Sapphire wafers are mainly suitable for the research and development of new devices, offering high speci...

... for the ultra-high-purity demands of and LCD , delivering residue-free, damage-free cleaning critical for electronic compo...

...a metal material that uses a molybdenum-copper as a base material and covers a uniform nickel layer on the surface of the molybdenum-copp...

... size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm; ● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-...

... As III-Nitride Materials PAM-XIAMEN has established the manufacturing technology for freestanding (Gallium Nitride)GaN sub...

...a metal material that uses a molybdenum-copper as a base material and covers a uniform nickel layer on the surface of the molybdenum-copp...

... as carrier tape and protective during the dicing and grinding process. UV tape is mainly composed of release film, acrylic adhesive and ...

With wide direct bandgap(3.4 eV), strong atomic bonds, high thermal conductivity and excellent radiation resistance, GaN is not only short-wave-length...

Semiconductor Ceramic Wafer Chucking Substrate for Picking Up Wafer Key word: Ceramic Wafer Chucking Substrate Products : Ceramic Chucks and wafer end...

...SI SIicon Carbide wafer supplier Homray Material Technologyprovide high quality silicon carbide SiC wafer to electronic and...