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99% Alumina Ceramic Components Chip Thin Film Circuit Semiconductor

99% Alumina Ceramic Components Chip Thin Film Circuit Semiconductor

Brand Name:HY
Certification:CE
Model Number:HY-TCJP
Minimum Order Quantity:10 pieces
Delivery Time:20-30 working days
Payment Terms:L/C, D/P, T/T, Western Union
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Address: Chuanbu Village,Ceramics Industrial Park,Dingshu Town,Yixingcity,China
Supplier`s last login times: within 25 hours
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Product Details

Alumina ceramic basic chip thin-film circuit semiconductor-integrated circuit led lamp


Alumina ceramic basic chip

product name:Alumina ceramic basic chip

product description:

As a substrate material, alumina ceramic substrate is widely used in RF and microwave electronics industry. Its high dielectric constant can make the circuit miniaturized. Its thermal stability is good, the temperature drift is small, the substrate strength and chemical stability are high, and the performance is better than most other oxide materials. It can be applied to various types of thick film circuits, thin film circuits, hybrid circuits, microwave module modules, etc. Alumina ceramic substrate can be processed based on thin film lithography process, and its accuracy can reach micron level. Many passive devices can be designed based on alumina ceramic substrate. Because its dielectric constant is higher than that of general PCB substrate, the size of the designed device is small, which has a very significant advantage in the development trend of miniaturization of various component modules. Alumina ceramic substrate plays an important role in the development of microwave radio frequency.


Circuit Application of Alumina Ceramic Substrate
1 Thin film microstrip circuit
2 thin film filter
3 thin film load
4 Thin film equalizer
5 thin film power divider
6 Thin film attenuator
7 thin film coupler
8 thin film bridge
9 thin film resistance
10 thin film capacitor


products index:

Ceramic characteristic table
name99% AL2O395% AL2O3
physical propertyessential componentessential componentAL2O3≥99%AL2O3≥95%
Density(g/cm3)3.853.6
water absorption%00
sintering temperature16901670
material charactersHardness(HV)17001600
break off strength>6500>2900
compressive strength3000025000
thermal responsemaximum service tempera- ture15001400
thermal expansion coefficient87.8
10-6/℃
0-1000℃
Heat shock resistance T(℃)200220
thermal conductivity W/m.k3122
electrical specificationvolume resistivity Ω.cm>1012>1012
Insulation destructive power KT/m1816
dielectric constant 1MHZ(E)9.2-10.59.0-10

Product production process steps:

1 Hot grouting molding equipment 2 Dry powder molding press 3 Automatic dry powder forming equipment

4High temperature kiln workshop firing 5 Product firing 6 processing units

7processing units 8 processing units 9 product presentation

China 99% Alumina Ceramic Components Chip Thin Film Circuit Semiconductor supplier

99% Alumina Ceramic Components Chip Thin Film Circuit Semiconductor

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