... ensures high uniformity and surface quality, making it suitable for materials such as silicon, GaAs, , and SiC. It plays an essential r...
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...automatic room temperature bonding Semi-automatic room temperature bonding 2/4/6/8/12inch Compatible material Sapphire Si SiC InP G...
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... Single Lane Technical Specification 1.Voltage: 380V/50HZ 2.Covering Area: 4.0M*1.2M 3.The total Power: L800-A:8KW L800-C:5KW 4.Maximum Prod...
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The bridge erecting machine is the equipment to The jib of jqj160t-40m highway bridge erecting machine is composed of left and right box girders, whic...
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3D Laser Welding System 3020 3D laser welding is a five-axis coordinated laser welding equipment with cartesian coordinate axes. Features:...
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... grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on differ...
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