ceramic semiconductor

Wafer Boat for Diffusion of 8" Wafer Processing 25 wafer boat Key words : Wafer Boat Features: 8" wafer boat is ma...

Product Description: 1 Test physical changes of IC,PCB, and other high polymer materials. 2 High and low temperature liquid tan...

Basic Description The dicing system, refers to install a slim blade for special cutting at the head of the spindle,cut off glass, ceramic, semiconduct...

6MPA Dewaxing pressure sintering furnace for cermets,non-cermets,pricison ceramic,semiconductor silicon nitride Equipment system It mainly includes co...

13/32 X 2 Fuse Data Sheets & Stock Check with our customer service by email or phone. What is a 13/32 x 2 fuse? A 13/32 x 2 inch fuse is a non-current...

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Fuse Links Selection Guide: The purpose of using fuses is to out off the line safely and correctly to protect discrete components or the whole line in...

... chucks Pad High temperature resistance Al2O3 Parts As a precision parts manufacturer, we produc...

... vibration tube sensor pzt-5/pzt-8 material Piezoelectric materials in s, s are many. The property...

... tray Used to support materials wafers Excellent corrosion resistance. silicon carbide tray‘s short brief Silicon carb...

... Arm For Wafer Drive Of ZG produced arm for wafer drive of feature good structural strength, hig...

Refrigerators PCB Board OSP 0.4mm Green Color PCB Board Refrigerators Green ​ Printed Circuit Board...

... slow blow fast blow 690V 600V 10*38mm cylinder Industrial fuse fuse Rated 0.1A to 50A,125V to 1000V Fit for 10x38mm fuse Mate...

... are widely used in many fields. Alumina can meet the requirements of daily use and specific properties due to their excellent per...

... technical continues to grow. Modern fabricates structural components for a variety of industrial applications. A few exa...

...as deep groove ball bearing. Inch Sizes Ball Bearings – Inch dimensional series with bore sizes ranging from 3/32″ to 1-1/2″ Metric...

... (SiC), Silicon nitride (Si3N4) 2. Forming method: ISO pressed, Dry pressed, injection molding, Hot pressed and Extrusion and so on 3. Type...

... epitaxy layer. Application ICP etching process of epitaxial film materials(GaN, SiO 2, etc.) for LED wafer chips, precision parts for...

6inch 1.0mmAluminum Nitride AlN Ceramic Substrate, High Thermal Conductivity, Customized AlN Ceramic,6inch ceramic substrates AlN Introduce The alumin...

99.5% Alumina Industry Application Handling Arms Advanced Technical s Components Product Description Alumina pist...