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Thermal conductive gap pad for semiconductor automated equipment (),20±5 Shore 00,3.0 W/m-K The TIF1120-30-11US is recommended for application...

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... function: OVP, OCP, OPP and SCP MTBF: >50,000 hours at 25°C Case: SECC 0.5, 0.6, 0.8mm 100% , 100% high-temperature burn in (45 to52°...

... function: OVP, OCP, OPP and SCP MTBF: >50,000 hours at 25°C Case: SECC 0.5, 0.6, 0.8mm 100% , 100% high-temperature burn in (45 to52°...

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...: *Over-Voltage protection *Over-Current protection *Short-Circuit protection *IC protection *100% Hi-pot&(Chroma) *100% Burn-in *MTBF Abo...