Thermal Conductive Gap Pad For Semiconductor ATE 20±5 Shore 00 3.0 W/M-K
Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF1120-30-11US
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Place of Origin:China
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Location:
Dongguan Guangdong China
Address:
No.12 Xiju Road,, Hengli Township, 523460 Dongguan City
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Product Details
Company Profile
Product Details
Thermal conductive gap pad for semiconductor automated test equipment (ATE),20±5 Shore 00,3.0 W/m-K
The TIF1120-30-11US is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek ***(导热片型号) is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
TIF100-30-11US-Series-Datasheet-.pdf
Features
> Good thermal conductive: 3.0 W/mK
>Thickness:3.0mmT
>hardness:20±5 shore00
>Colour: gray
>UL recognized
>Fiberglass reinforced for puncture, shear and tear resistance
>Easy release construction
Applications
>Semiconductor automated test equipment (ATE)
>CPU
>display card
>Automotive electronics
>Set top boxes
>Audio and video components
Typical Properties of TIF1120-30-11US Series | ||||
Color | gray | Visual | Composite Thickness | Thermal Impedance@10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.16 |
20mils / 0.508 mm | 0.20 | |||
Specific gravity | 3.0g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
40mils / 1.016 mm | 0.36 | |||
| Thickness | 3.0mmT | *** | 50mils / 1.270 mm | 0.42 |
60mils / 1.524 mm | 0.48 | |||
Hardness | 20±5 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
80mils / 2.032 mm | 0.63 | |||
Outgassing(TML) | 0.35% | ASTM E595 | 90mils / 2.286 mm | 0.73 |
100mils / 2.540 mm | 0.81 | |||
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 0.86 |
120mils / 3.048 mm | 0.93 | |||
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.00 |
140mils /3.556 mm | 1.08 | |||
Dielectric Constant | 4.0 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
160mils / 4.064 mm | 1.20 | |||
Volume Resistivity | 1.0X1012 Ohm-cm | ASTM D257 | 170mils / 4.318 mm | 1.24 |
180mils / 4.572 mm | 1.32 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.41 |
200mils / 5.080 mm | 1.52 | |||
Thermal conductivity | 3.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge
Q: What is your terms of payment ?
A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.
Thermal Conductive Gap Pad For Semiconductor ATE 20±5 Shore 00 3.0 W/M-K
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