Smt Sub Contract Prototype Electronic Pcb Assembly Fabrication Consumer Products
Brand Name:FASTPCB
Minimum Order Quantity:10PCS
Place of Origin:CHINA
Price:USD 0.01-100/PCS
Supply Ability:10PCS+48Hour
Packaging Details:Corrugated case
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Location:
Shenzhen Guangdong China
Address:
Building B, Shangxing West Industrial Zone, No. 1001, West Ring Road, Shajing street, Bao'an District, Shenzhen, Guangdong, China
Supplier`s last login times:
within 23 hours
Product Details
Company Profile
Product Details
Consumer electronics refers to electronic products used by everyday consumers. Consumer electronics products are made all over the world, with relatively concentrated production in mainland China due to its low-cost advantage
Since the late 1990s, the information home appliance, which integrates computer, information and communication and consumer electronics, has been widely used in family life. It has functions such as audio-visual, information processing and two-way network communication. It consists of embedded processor, related supporting hardware (such as display card, storage medium, IC card or credit card reading device), embedded operating system and software package of application layer. Broadly speaking, information home appliances include all home appliances that can exchange information through the network system, such as PC, set-top box, HPC, DVD, super VCD, wireless data communication equipment, video game equipment, intelligent TV box, WEBTV and so on. At present, audio, video and communication equipment is the main component of information home appliances. In the long run, refrigerators, washing machines, and microwave ovens will also develop into information home appliances and form part of smart home appliances.
HLC Process capability
| Item | HLC Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Max Panel Width (inch) | 25 | 25 | 25 | |
| Max Panel Length (inch) | 29 | 29 | 29 | |
| Max Layer Count (L) | 16 | 18 | 36 | |
| Max Board thickness (mm) | 3.2 | 4 | 6 | |
| Max Board thickness Tolerance | +/-10% | +/-10% | +/-10% | |
| Base copper Thickness | Inner layer ( OZ ) | 4 | 6 | 8 |
| Outer Layer ( OZ ) | 2 | 3 | 4 | |
| Min DHS ( mm ) | 0.2 | 0.15 | 0.15 | |
| PTH Size Tolerance ( mil ) | +/-2 | +/-2 | +/-2 | |
| Back Drill (stub)( mil ) | ~ 3 | ~ 2.4 | ~ 2 | |
| Max. AR | 12:1 | 16:1 | 20:1 | |
| Item | HLC Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| M-drill tolerance | Inner layer ( mil ) | DHS + 10 | DHS + 10 | DHS + 8 |
| Outer Layer ( mil ) | DHS + 8 | DHS + 8 | DHS + 6 | |
| Solder mask Registration (um) | +/- 40 | +/- 30 | +/- 25 | |
| Impedance control | ≥50ohms | +/-10% | +/-10% | -/-8% |
| <50ohms | 5 Ω | 5 Ω | 4 Ω | |
| Min LW/S (Inner)@1oz base Cu ( mil ) | 3.0 / 3.0 | 2.6 / 2.6 | 2.5 / 2.5 | |
| Min LW/S (Outer)@1oz Cu ( mil ) | 3.5 / 3.5 | 3.0 / 3.5 | 3.0 / 3.0 | |
| Max dimple for POFV ( um ) | 30 | 20 | 15 | |
| Surface Finishing | ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au | |||
HDI Process capability
| Item | HDI Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Structure | 5+n+5 | 6+n+6 | 7+n+7 | |
| HDI Stack Via | AnyLayer(12L) | AnyLayer(14L) | AnyLayer(16L) | |
| Board Thickness(mm) | Min. 8L | 0.45 | 0.4 | 0.35 |
| Min. 10L | 0.55 | 0.45 | 0.4 | |
| Min. 12L | 0.65 | 0.6 | 0.55 | |
| MAX. | 2.4 | |||
| Min. Core Thickness ( um ) | 50 | 40 | 40 | |
| Min. PP Thickness ( um ) | 30(#1027PP) | 25(#1017PP) | 20(#1010PP) | |
| Base Copper Thickness | Inner Layer ( OZ) | 1/3 ~ 2 | 1/3 ~ 2 | 1/3 ~ 2 |
| Outer Layer ( OZ ) | 1/3 ~ 1 | 1/3 ~ 1 | 1/3 ~ 1 | |
| Item | HDI Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Min. Mechanical Drill hole size(um) ** | 200 | 200 | 150 | |
| Max. Through Hole Aspect Ratio * | 8:1 | 10:1 | 10:1 | |
| Min. Laser via/Pad Size ( um ) | 75/200 | 70/170 | 60/150 | |
| Max. Laser Via Aspect Ratio | 0.8:1 | 0.8:1 | 0.8:1 | |
| Laser Via on PTH(VOP)design | Yes | Yes | Yes | |
| Laser X type through hole(DT≤200um) | NA | 60~100um | 60~100um | |
| Min. LW/S (L/S/Cu, um) | Inner Layer | 45 /45 /15 | 40/ 40/ 15 | 30/ 30 /15 |
| outer Layer | 50 /50/ 20 | 40 /50 /20 | 40 /40 /17 | |
| Min BGA Pitch (mm) | 0.35 | 0.3 | 0.3 | |
| Item | HDI Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Solder mask Registration (um) | +/- 30 | +/- 25 | +/- 20 | |
| Min. Solder Mask Dam (mm) | 0.07 | 0.06 | 0.05 | |
| PCB Warpage Control | >= 50ohm | +/-10% | +/-8% | +/- 5% |
| < 50ohm | +/- 5ohm | +/- 3ohm | +/- 3ohm | |
| PCB Warpage Control | ≤0.5% | ≤0.5% | ≤0.5% | |
| cavity Depth accuracy (um) | Mechanical | +/- 75 | +/- 75 | +/- 50 |
| Laser directly | +/- 50 | +/- 50 | +/- 50 | |
| Surface Finishing | OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag | OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG | ||
SMT Capability
| Item | SMT Capability | |||
| 2019 | 2020 | 2021 | ||
| Min board thickness ( mm ) | 0.1 | 0.06 | 0.05 | |
| Max. board size ( mm ) | 200 x 250 | 250 x 300 | 250 x 350 | |
| Chip component ( L, C, R etc. ) | Minimum size | 1005 | 1005 | 1005 |
| Connector | 0.5 mm pitch | Y | Y | Y |
| 0.4 mm pitch | Y | Y | Y | |
| 0.35 mm pitch | Y | Y | Y | |
| High density component : | 0.5 mm pitch | Y | Y | Y |
| TSOP, QFP, QFN, LGA, BGA etc. | 0.4 mm pitch | Y | Y | Y |
| 0.35 mm pitch | Y | Y | Y | |
| Reflow | N2 reflow | No | Y | Y |
| Under-fill | Fill under chip | Manual | Auto | Auto |
| ACF attach | Gold finger pitch | N/A | 0.3 mm | 0.2 mm |
| Inspection | Component position, direction, missing etc. | Manual check with 10 x scope | Auto AOI inspection | Auto AOI inspection |
| Solder paste thickness | Measure once per shift | 1 line auto full area, online SPI | All lines auto full area, online SPI | |
| Packaging & Delivery | |||||
| Packaging Details: | Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement. | ||||
| Port: | Shenzhen or Hongkong | ||||
| Lead Time: | Quantity(Pieces) | 1-10 | 11-100 | 101-1000 | >1000 |
| Est. Time(days) | 3-5 | 3-5 | 7-9 | To be negotiated | |
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication,
SMT, plastic injection & metal,final assembly, testing and
other value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic
requirements(material,size, surface finish treatment, copper
thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side
local law and promising tokeep customers data in high confidential
level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home,
Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can
support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China
Smt Sub Contract Prototype Electronic Pcb Assembly Fabrication Consumer Products
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