Alumina Ceramic Heat Dissipation Substrates And Filtration Components: Core Solutions For Electronics And Precision

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Location: Jinhua Zhejiang China
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Alumina Ceramic Heat Dissipation Substrates and Filtration Components: Core Solutions for Electronics and Precision

Instruments

Product Introduction

Alumina ceramic heat dissipation substrates and filtration components are made from high-purity (96%-99.6%) alumina material, specifically designed for thermal management in electronic devices and filtration needs in precision instruments. Utilizing advanced ceramic forming technology and precision machining processes, these products exhibit excellent thermal conductivity, chemical stability, and mechanical strength, making them critical functional materials in modern electronics and precision instrument manufacturing.

Main Applications

  • Electronic Equipment: LED heat dissipation substrates, power module substrates, integrated circuit packaging, semiconductor heat sinks

  • Precision Instruments: Gas filtration elements, liquid filtration membrane supports, analytical instrument filter elements, vacuum system filters

  • Special Applications: Laser heat dissipation bases, photovoltaic equipment insulation components, aerospace filtration systems

Core Advantages

  • Excellent Thermal Conductivity: Thermal conductivity 20-30W/(m·K), thermal expansion coefficient matches silicon chips

  • High Porosity Control: Filtration accuracy adjustable from 0.1-100μm, porosity controllable at 30-50%

  • Outstanding Heat Resistance: Withstands temperatures up to 1600℃, excellent thermal stability

  • Good Chemical Inertia: Resistant to acid and alkali corrosion, suitable for various chemical environments

  • High Mechanical Strength: Compressive strength ≥2000MPa, long service life

  • Precise Dimensional Control: Flatness ≤0.01mm/m, surface roughness Ra≤0.2μm

Specification Parameter Table

ParameterTechnical Indicators
Alumina Content96%/99%/99.6%
Thermal Conductivity20-30W/(m·K)
Porosity30-50% (filtration components)
Filtration Accuracy0.1-100μm
Compressive Strength2000-2800MPa
Thermal Expansion Coefficient6.5-7.5×10⁻⁶/K
Operating Temperature-60℃ to 1600℃
Surface RoughnessRa≤0.2μm
Dielectric Strength≥15kV/mm

Process Flow

Raw material selection → Formula optimization → Granulation forming → Isostatic pressing/injection molding → Precision machining → High-temperature sintering → Porosity regulation → Surface treatment → Performance testing → Vacuum packaging

Usage Instructions

  1. Clean contact surfaces before installation to ensure no contaminants

  2. Apply thermal grease to heat dissipation substrates to ensure good thermal contact

  3. Pay attention to flow direction indicators when installing filtration components to avoid reverse installation

  4. Operating temperature changes should be gradual to avoid thermal shock

  5. Regularly check performance indicators and replace failed components promptly

After-Sales Service

  • 18-month quality guarantee

  • Professional technical support team

  • 36-hour rapid response

  • Free application technical guidance

FAQ

Q: What are the advantages of alumina ceramic heat dissipation substrates compared to aluminum substrates?
A: They offer better insulation, higher heat resistance, and better matched thermal expansion coefficients, making them particularly suitable for heat dissipation in high-power devices.

Q: What is the service life of filtration components?
A: Depending on the usage environment, generally 6-24 months, and service life can be extended through backwashing.

Q: Is customization of porosity and filtration accuracy supported?
A: Yes, customized pore structures and filtration accuracy are available according to customer requirements.

Q: How to test the performance of heat dissipation substrates?
A: Thermal resistance can be measured using a thermal resistance tester, or temperature distribution can be observed using an infrared thermal imager.



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