Dense And Non-Porous Alumina Ceramic Ring Component For Electronics And Semiconductors - precisionceramicparts

Dense And Non-Porous Alumina Ceramic Ring Component For Electronics And Semiconductors

Brand Name:Dayoo
Minimum Order Quantity:Negotiable
Delivery Time:Negotiable
Payment Terms:Negotiable
Place of Origin:Made In China
Price:Negotiable
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Location: Jinhua Zhejiang China
Address: No. 6, Shuangjin Street, Qiubin Industrial City, Qiubin Street, Wucheng District, Jinhua, Zhejiang
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Dense And Non-Porous Alumina Ceramic Ring Component For Electronics And Semiconductors


This high-precision alumina ceramic ring component (purity ≥95%) is manufactured using isostatic pressing technology, featuring an 乳白色瓷质 luster with a precision structure consisting of an annular body + 6 sets of symmetrical notches + 6 positioning round holes. The product surface exhibits dense, non-porous characteristics after sintering at 1600°C, with rounded edge treatment ensuring installation safety, suitable for core transmission systems of automation equipment.

[Core Applications]

  1. Precision Machinery: High-speed motor bearing retainers, servo system positioning rings
  2. Electronics & Semiconductors: IC test fixture insulation bases, wafer carrier positioning components
  3. New Energy: Lithium battery pole piece cutting dies, hydrogen fuel cell bipolar plate frames
  4. Medical Devices: Minimally invasive surgical instrument guide sleeves, dental implant abutment connectors

[Performance Advantages]

✅ Physical Properties: Hardness HRA90-92 (comparable to sapphire), flexural strength ≥350MPa
✅ Weather Resistance: Operating temperature -200°C~1600°C, thermal expansion coefficient 6.8×10⁻⁶/°C
✅ Chemical Stability: Resistant to strong acids and alkalis (except hydrofluoric acid), insulation resistance >10¹⁴Ω
✅ Precision Control: Dimensional tolerance ±0.01mm, surface roughness Ra0.4μm

[Specification Parameter Table]

Parameter ItemIndex ValueTest Standard
Outer Diameterφ50±0.02mmGB/T 2848-2015
Inner Diameterφ20±0.01mmGB/T 2848-2015
Thickness8±0.01mmGB/T 2848-2015
Number of Notches6 sets symmetricCustom Drawing
Positioning Hole Diameterφ4±0.01mmGB/T 2848-2015
Density3.85g/cm³GB/T 25995-2010

[Production Process]

Raw material proportioning → Ball milling → Spray granulation → Isostatic pressing → Degreasing → High-temperature sintering → CNC precision machining → Ultrasonic cleaning → Laser inspection → Vacuum packaging

[Usage Instructions]

  1. Use special ceramic clamping tools during installation to avoid hard force collision
  2. Control temperature changes in working environment to ≤5℃/min
  3. Clean with anhydrous ethanol ultrasonic cleaning (power ≤40kHz)
  4. Do not store with metal hard objects; use anti-static packaging boxes

[After-Sales Service]

✓ Free replacement for non-human damage within 1-year warranty period
✓ Customization with drawings
✓ Third-party material testing reports

[FAQ]

Q: Does the product support high-temperature and high-pressure sterilization?
A: Can withstand 134℃ high-pressure steam sterilization (complies with ISO 17665 standard)

Q: Is RoHS environmental certification available?
A: The entire product series has passed RoHS 2.0 ten-item testing (Report No.: ENV20230512007)


China Dense And Non-Porous Alumina Ceramic Ring Component For Electronics And Semiconductors supplier

Dense And Non-Porous Alumina Ceramic Ring Component For Electronics And Semiconductors

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