Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing
Brand Name:TECircuit
Certification:UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Model Number:TEC0153
Minimum Order Quantity:1pcs
Delivery Time:5-15 wotk days
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
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Verified Supplier
Location:
Shenzhen China
Address:
Room404,Building A2,Shunjing Pioneer Park,NO3 Longteng 3rd road, jixiang community,longcheng street,longgang district,ShenZhen, China
Supplier`s last login times:
within 2 hours
Product Details
Company Profile
Product Details
Product Images
About TECircuit
Found: TECircuit has been operating since 2004.
Location: An electronics manufacturing service(EMS) provider located in
Shenzhen China.
Item: Customizable EMS PCB, offers a full range of one-stop shop services.
Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.
Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.
Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly
production capacity : 100,000 m2
Product Applications
Main Logic Board:
- Used in the central processing unit (CPU) and graphics processing unit (GPU) circuits, providing high-density connections for powerful performance.
Display Interface:
- Employed in connections for touchscreens and LCD/LED displays, ensuring high-resolution output and responsiveness.
Power Management Systems:
- Integrated into circuits that manage battery charging, power distribution, and energy efficiency to prolong battery life.
Wireless Communication Modules:
- Used in Wi-Fi, Bluetooth, and cellular connectivity components, ensuring reliable and fast data transmission.
Camera Modules:
- Employed in circuits that support front and rear cameras, enabling high-quality image and video processing.
Audio Systems:
- Integrated into audio amplifier circuits and speaker connections, providing high-quality sound output.
Sensors:
- Used in various sensors, such as accelerometers and gyroscopes, enhancing functionalities like orientation detection and motion sensing.
Storage Interfaces:
- Employed in connections for flash memory storage, ensuring fast data access and transfer rates.
Charging Ports:
- Integrated into USB-C or other charging interfaces, facilitating efficient power transfer and data connectivity.
Thermal Management Systems:
- Used in designs that require effective heat dissipation, maintaining optimal performance during prolonged use.
Product Features
High Density:
- HDI (High-Density Interconnect) PCBs allow for compact designs with a high number of components, essential for slim tablet profiles.
Improved Signal Integrity:
- Shorter traces and optimized routing enhance signal quality, crucial for high-speed data transfer and communication.
Better Thermal Management:
- Advanced materials and multilayer designs help dissipate heat effectively, preventing overheating during intensive tasks.
Enhanced Routing Flexibility:
- The use of microvias and buried vias allows for complex circuit layouts, maximizing space efficiency.
Lightweight Design:
- Reduced material usage contributes to lighter tablet designs, improving portability and user experience.
Cost Efficiency in Mass Production:
- While initial costs may be higher, HDI PCBs can be cost-effective for large-scale manufacturing due to their performance advantages.
Customizability:
- Can be tailored to meet specific design requirements, enabling unique layouts and configurations for various tablet models.
Durability:
- Built to withstand environmental factors, ensuring reliable performance in everyday use.
Regulatory Compliance:
- Designed to meet industry standards for safety and performance, ensuring dependable operation in consumer electronics.
Ease of Integration:
- Compatible with a wide range of components, facilitating the incorporation of advanced features and technologies in tablets.
FAQ
Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface
finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)
Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA
Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP
for our customers in the whole process. All documents from
customers are never shared with any 3rd parties.
Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer
provided shipment method is acceptable.
Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is
acceptable.
Product Description
| Specification: | |||||
| PCB layers: | 1-42layers | ||||
| PCB materials: | CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free | ||||
| PCB max. board size: | 620mm*1100mm | ||||
| PCB certificate: | RoHS Directive-Compliant | ||||
| PCB Thickness: | 1.6 ±0.1mm | ||||
| Out Layer Copper Thickness: | 0.5-5oz | ||||
| Inner Layer Copper Thickness: | 0.5-4oz | ||||
| PCB max. board thickness: | 6.0mm | ||||
| Minimum Hole Size: | 0.20mm | ||||
| Minimum Line Width/Space: | 3/3mil | ||||
| Min. S/M Pitch: | 0.1mm(4mil) | ||||
| Plate Thickness and Aperture Ratio : | 30:1 | ||||
| Minimum Hole Copper: | 20µm | ||||
| Hole Dia. Tolerance(PTH): | ±0.075mm(3mil) | ||||
| Hole dia. Tolerance(NPTH): | ±0.05mm (2mil) | ||||
| Hole Position Deviation: | ±0.05mm (2mil) | ||||
| Outline Tolerance: | ±0.05mm (2mil) | ||||
| PCB solder mask: | Black, white, yellow | ||||
| PCB surface finished: | HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver | ||||
| Legend: | White | ||||
| E-test: | 100% AOI, X-ray, Flying probe test. | ||||
| Outline: | Rout and Score/V-cut | ||||
| Inspection Standard: | IPC-A-610CCLASSII | ||||
| Certificates: | UL (E503048),ISO9001/ISO14001/IATF16949 | ||||
| Outgoing Reports: | Final Inspection, E-test, Solderability Test, Micro Section and More | ||||
Multilayer Rigid HDI PCB Printed Circuit Board Tablet Computer Electronics Manufacturing
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