High TG FR4 Multi Level Printed Circuit Board Fabrication For Various Layer Counts

Product Description:

High TG FR4 Multi-Level Printed Circuit Board Fabrication For Various Layer Counts

Multilayer PCB Fabrication is a process that produces multi-layer printed circuit boards (PCBs) for use in a variety of electronic products. During the fabrication process, copper layers are laminated together to create the desired number of layers. The layers are then processed with the appropriate silkscreen color, copper thickness, solder mask color, and board thickness. The process is completed with the addition of the desired components, such as capacitors, resistors, and integrated circuits, and the application of the finishing touches, such as soldering, testing, and inspection. The outcome of the fabrication process is a high-quality multi-layer PCB with excellent performance and long-lasting durability.

The silkscreen colors available for multi-layer PCB fabrication include white, black, yellow, and others. The copper thickness is customizable, ranging from 1 to 4oz. The solder mask color choices include green, blue, white, black, red, and more. The minimum hole size is 0.2mm and the board thickness is available in sizes from 0.2mm to 3.2mm. With the capability to produce multi-level PCBs, our multi-layer PCB fabrication process offers an ideal solution for complex components and assemblies.

Our multi-layer printed circuit board production processes adhere to the highest standards in the industry and are backed by our commitment to quality assurance. We take pride in our ability to offer customers the highest level of multi-level printed circuit board fabrication and component assembly. Contact us today to learn more about our multi-layer PCB fabrication services.

Features:

• Product Name: Multilayer PCB Fabrication
• Layer Count: 2-20
• Silkscreen Color: White, Black, Yellow, Etc.
• Min. Line Spacing: 0.1mm
• Board Thickness: 0.2-3.2mm
• Material: FR4, High TG FR4, Halogen Free, Rogers, Etc.
• Multi-Level Printed Wiring Board Creation
• Multi-Layer PCB Component Assembly
• Solder Masking
• Copper Plating
• Profiling
• Drilling
• Routing

Technical Parameters:

Applications:

JIETENG multi-level printed circuit board fabrication is the ideal choice for a wide range of applications, from prototyping and development to production runs. Our high-quality PCBs are designed to meet the highest standards and are produced with the latest technology. Our PCBs are manufactured with copper thicknesses of 1-4oz, and feature silkscreen colors of white, black, yellow, and more. Our minimum line spacing is 0.1mm and we can produce PCBs with 2-20 layers. We use a variety of materials, including FR4, high TG FR4, halogen free, Rogers, and more. Our multi-level printed circuit board fabrication is perfect for a wide range of products that require precise and reliable PCBs. With our high-quality materials and advanced technology, you can trust JIETENG to provide the best multi-layer printed circuit board production and multi-level printed wiring board creation. When you need a reliable PCB for your product, trust JIETENG for superior multi-layer PCB design.

Customization:

JIETENG Multi-Layer PCB Fabrication Service

Brand Name: JIETENG

Model Number: PCB circuit board

Place of Origin: China

Material: FR4, High TG FR4, Halogen Free, Rogers, Etc.

Solder Mask Color: Green, Blue, White, Black, Red, Etc.

Impedance Control: Yes

Layer Count: 2-20

Min. Hole Size: 0.2mm

JIETENG specializes in multi-level printed wiring board creation, multi-layer PCB component assembly and multi-layer printed circuit board production. Our state of the art equipment and professional engineering staff allow us to meet our customer's needs for quality, performance and cost. Our PCB fabrication services include a wide variety of materials and layer counts. We offer FR4, High TG FR4, Halogen Free, Rogers, etc. as material option with solder mask color options such as green, blue, white, black, red, etc. In addition, our services include impedance control and minimum hole size of 0.2mm.

Support and Services:

We provide technical support and service for Multilayer PCB fabrication. Our knowledgeable and experienced engineers are available to answer questions and provide guidance on any issue related to the fabrication process. We also provide technical resources such as whitepapers, datasheets and tutorials to help you create the best PCB design possible. We offer free, no-obligation quotes and can provide advice on the best PCB materials and components to use in your design.

We understand that Multilayer PCB fabrication is a complex process and our technical support team is available to help you through any challenges you may face. Our team is experienced in a variety of fabrication processes and is well-versed in the latest technologies and techniques. We can help you optimize your design for maximum performance and reliability.

If you have any questions or need help with your Multilayer PCB fabrication, please do not hesitate to contact us. Our team is ready to assist you with any issue related to the fabrication process.

Packing and Shipping:

Packaging and Shipping for Multilayer PCB Fabrication:

The multilayer PCBs are packaged in static-free bags and shipped in protective boxes. The antistatic bags are sealed to ensure no contaminants get into the PCBs. The boxes are made of corrugated cardboard, which is strong enough to protect the multilayer PCBs from shocks and vibrations during transportation. The boxes are also marked with "Fragile" labels to ensure the safe handling of the PCBs.

FAQ:

Q1: What is Multilayer PCB Fabrication?

A1: Multilayer PCB Fabrication is a process of producing printed circuit boards (PCBs) with multiple layers that are connected by electrical traces. It is provided by JIETENG, with model number PCB circuit board and place of origin China.

Q2: What are the advantages of Multilayer PCB Fabrication?

A2: Multilayer PCB Fabrication has many advantages, such as increased design complexity, better signal isolation, improved electrical performance, improved noise reduction, and increased reliability.

Q3: What are the materials used in Multilayer PCB Fabrication?

A3: The materials used in Multilayer PCB Fabrication include copper, dielectric layers, and conductive and non-conductive adhesives.

Q4: What are the steps involved in Multilayer PCB Fabrication?

A4: The steps involved in Multilayer PCB Fabrication include designing the PCB, printing the layers, laminating the layers, drilling holes, soldering components, and testing the PCB.

Q5: What are the applications of Multilayer PCB Fabrication?

A5: Multilayer PCB Fabrication is widely used in many applications, such as aerospace, medical, automotive, and consumer electronics.