High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
Brand Name:Ziitek
Certification:RoHS
Model Number:TIE380-25
Minimum Order Quantity:10kg
Delivery Time:3-8 work days
Payment Terms:T/T
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Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, China
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within 2 hours
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Product Details
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Product Details
2022 high thermal conductivity thermal conductive epoxy glue good adhesive for bonding electronics
TIE™380-25High Performance Thermal Conductivity Of The Epoxy Adhesive
Product Summary:
TIE™380-25 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling
Feature
| Outstanding thermal performance 2.5W/mK |
| High tack surface reduces contact resistance |
| RoHS compliant |
| UL recognized |
| Fiberglass reinforced for puncture, shear and tear resistance |
| Easy release construction |
Applications
| Heat pipe thermal solutions |
| Memory Modules |
| Mass storage devices |
| Automotive electronics |
| Set top boxes |
| Audio and video components |
| IT infrastructure |
| GPS navigation and other portable devices |
Typical Properties of TIETM380-25 | ||
| Chemical type | Epoxy | Test Method |
| Appearance uncured | Gray Paste | Visual |
| Appearance cured | Dull Gray Solid | Visual |
| Components | One Component | ***** |
| Heat Capacity | 0.7 l/g-K | ASTM C351 |
| Key Substrates | Metals, ceramics | ***** |
| Hardness | 92 Shore A | ASTM 2240 |
| Continuous Use Temp | -40 to 180℃ | ***** |
| Tensile strength Al/Al @25°C | >2800psi | ***** |
| Thermal Conductivity | 2.5 W/m-K | ASTM D5470 |
Application Features:TIE™380-25
Color Gray
Viscosity@25℃ 140,000 cPs
Specific Gravity@25℃ 2.1 g/cc
Shelf life @25℃° 10 Days
@0℃° 6 Months
(Storage methods and temperature will affect the shelf life)
Curing procedures:
Curing temperature Curing time
100℃° 3 Hours
125℃ 1.5 Hour
150℃ 20 Minutes
170℃ 5 Minutes
Package:
1kg/can
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
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