Custom Sic Ceramics Carrier End Effector For Wafer Handling

Brand Name:ZMSH
Certification:rohs
Model Number:SiC Finger Fork
Delivery Time:2-4weeks
Payment Terms:T/T
Place of Origin:CHINA
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Location: Shanghai Shanghai China
Address: Room.1-1805,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799
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Abstract of End Effector for Wafer Handling


Customized Sic Ceramics carrier End Effector for Wafer Handling


The wafer handling end effector, manufactured with ultra-precision machining technology, achieves micron-level dimensional accuracy (±0.01mm) and exceptional thermal stability (CTE ≤4.5×10⁻⁶/K). Its surface features an advanced CVD-deposited nanocrystalline SiC protective layer (purity >99.995%), delivering superior surface finish (Ra<0.05μm) and wear resistance (wear rate <0.1μm/1000 cycles), while ensuring damage-free wafer transfer at high speeds (1.5m/s) with minimal particle generation (<5 particles/ft³). Our high-purity SiC-coated end effector demonstrates outstanding performance stability across extreme temperatures (-200°C~1200°C), excellent thermal uniformity (±1°C@150mm wafer) for epitaxial growth thickness consistency (±1.5%), and remarkable chemical resistance (pH1-13), maintaining reliable operation through >100,000 cycles.



Technical specification:


Crystal StructureFCC β phase
Densityg/cm ³3.21
HardnessVickers hardness2500
Grain Sizeμm2~10
Chemical Purity%99.99995
Heat CapacityJ·kg-1 ·K-1640
Sublimation Temperature2700
Felexural StrengthMPa (RT 4-point)415
Young’ s ModulusGpa (4pt bend, 1300℃)430
Thermal Expansion (C.T.E)10-6K-14.5
Thermal conductivity(W/mK)300


Key features of End Effector for Wafer Handling

1. Nanoscale SiC Protective Layer via CVD Technology

- Deposited using hot-wall CVD reactor (1200°C) with 20-50nm grain size

- Coating density ≥3.18g/cm³, porosity <0.1%


2. Exceptional High-Temperature Stability & Thermal Uniformity

- Maintains thermal conductivity ≥120W/m·K at 1000°C

-Thermal deformation <0.02mm/100mm (ASTM E228 certified)


3. Ultra-Fine SiC Crystalline Coating for Atomic-Level Smoothness

- Diamond slurry polished to Ra<0.3nm (AFM verified)

- Surface friction coefficient μ<0.15 (vs. silicon wafer)


4. Superior Chemical Resistance & Cleaning Durability

- Etching rate <0.01μm/cycle in SC1/SC2 solutions

- Passes 2000-cycle ozone water cleaning test (80°C)


5. Proprietary Structural Design Preventing Cracking/Delamination

- Stress buffer layer design (SiC/Si gradient transition)

- Withstands 1000 thermal shock cycles (-196°C~300°C) (MIL-STD-883 compliant)



Primary applications of End Effector for Wafer Handling


1. Semiconductor Front-End Processes:

· Wafer transportation within fabs (AMHS)

· Lithography tool loading/unloading


2. Advanced Packaging:

· Precision alignment for Fan-out and 3D IC stacking

· Ultra-thin wafer handling (<100μm) for GaN/SiC compound semiconductors


3. Vacuum Environments:

· Wafer transfer in PVD/CVD chambers



Process Compatibility, Materials & Applications

CategorySpecificationTechnical Parameters
Process Compatibility

High-speed transferSupports 300mm wafers at ≥1.5m/s, 0.5G acceleration
Ultra-thin wafer handlingStress-free gripping of 50μm wafers (optional vacuum chuck)
Cleanroom compatibilitySEMI S2/S8 certified, particle-free operation
Material Types

CVD-SiCUltra-high purity (Ra<0.1μm), ≤5nm node processes
RBSiCCost-effective for packaging/test applications
SiC-coated aluminumLightweight composite for non-critical processes
Core Functions

Traditional end effector replacementEliminates thermal deformation/contamination (vs quartz/aluminum)
Precision alignmentWafer-to-equipment (robots/process chambers)
Breakage reduction<0.001% breakage rate, improves OEE


Products pictures of End Effector for Wafer Handling


ZMSH is a leading provider of high-performance Silicon Carbide (SiC) wafer handling solutions, specializing in precision-engineered carrier plates and end effectors for semiconductor manufacturing. Our advanced SiC components feature ultra-pure CVD coatings with surface roughness below 0.1μm Ra, ensuring particle-free operation in Class 1 cleanroom environments. The products demonstrate exceptional thermal stability, maintaining dimensional accuracy within ±0.03mm across extreme temperature ranges from -200°C to 1300°C, with thermal expansion coefficients as low as 4.1×10⁻⁶/K.




Q&A​


1. Q: What are end effectors in material handling?
A: End effectors are the specialized devices attached to robotic arms that directly interact with and manipulate materials or products during handling operations.


2. Q:What are end effectors used for?
A: They are used for precise gripping, lifting, transferring, or positioning of items in automated systems, particularly in manufacturing and logistics.



Tag: #SiC Finger Fork, #SiC Coated, #SiC Tray, # High-Purity SiC, #High-purity Silicon Carbide, #Customizable, #End Effector for Wafer Handling


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Custom Sic Ceramics Carrier End Effector For Wafer Handling

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