High Frequency Microprocessors 0.95 W/mK Thermal changing materials Low Resistance -25℃ - 125℃

High Frequency Microprocessors Thermal Interface Pad Low Resistance -25℃ - 125℃

The TIC™800P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800P Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

The TIC™800P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

Features:

> 0.024℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required

Applications:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

Ziitek Thermal Conductive Materials & Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Ziitek D-U-N-S® Number: 656191068