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thermal compound cpu

1 - 20 Results for thermal compound cpu from 2746 Products

Grease Compound Paste For GPU Heat Sink LED Light TIGTM780-15 is environmentally safe silicone-based grease design...

Time : Oct,02,2026
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...-like state for long-term use at temperatures ranging from -40℃ to +180℃. It possesses excellent electrical insulation properties, outstanding ther...

Time : Oct,02,2026
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... Grease Graphics Desktop Notebook Cooling Paste Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and ly Conduc...

Time : Dec,09,2024
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Grease Paste Low Resistance Environmentally Friendly Silicon Paste Customization TIG™780-25 is environmentally safe silico...

Time : Oct,02,2026
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... overheating and reliability issue. TIG™780-56 is presenting paste products. They serve to moisten the contact surface sufficiently so as t...

Time : Sep,23,2026
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... - Grey Non-Curing Gap Fill Material Basic Product Attributes DOWSIL TC-5351 is a grey one-part non-curing conductive com...

Time : Jul,28,2026
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... 80mm Wifi USB Bluetooth Receipt Printer Product Specification XL-8060P is a receipt & label printer with high-end design and go...

Time : Dec,09,2024
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#detail_decorate_root .magic-0{border-bottom-style:solid;border-bottom-color:#53647a;font-family:Lucida Grande;font-size:24px;color:#53647a;background...

Time : Jul,07,2025
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#detail_decorate_root .magic-0{width:750px}#detail_decorate_root .magic-1{overflow:hidden;width:750px;height:510px;margin-top:0;margin-bottom:0;margin...

Time : Dec,09,2024
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Multi Colour Xpe Foam Material Chemical Crosslinked Pe Foam   EVA   XPE Materiral Ethylene Vinyl Acetate Copopymer   Chemical cross-linked polyethylen...

Time : Dec,09,2024
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... conductive Gray paste Non-curing type Product Features conductivity: 4.0 W/ m·K It contains metal powder to enhance the...

Time : Dec,10,2024
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... with conductive filler, stirred, mixed and encapsulated. It adopts dispensing design, when used with the glue mixing nozzle hit, easy to...

Time : Oct,01,2026
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... Conductivity Potting Silicone Is Used for Potting, Sealing and Heat Dissipation in Battery Management Systems (BMS) Free Samples, welcome t...

Time : Feb,10,2026
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... Expansion Phenolic Molding With Dielectric Strength 20-30 KV/Mm 2.5-4.5 X 10-5/K Product Description: Phenolic Moulding i...

Time : Aug,20,2026
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... for extreme heat dissipation requirements in power-dense electronic systems. With a conductivity rating of ≥2.0 W/m·K, low water absorptio...

Time : Jun,17,2026
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... Rubber O Ring Perfluoroelastomer Colored For O Rings High Temperature Resistance WHO WE ARE? ●Founded in 2002, Dowhon Gro...

Time : Oct,02,2026
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...high conductivity spherical alumina powder and Dow Corning polymer. It is a cost-effective gap filler material. The natural micro-s...

Time : Sep,14,2026
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Conductive Insulation Silicone Pad 15W 17W for Laptop Graphics Card GPU RTX 3080 3090​ ►Product Description: Enhance heat dissipation an...

Time : Oct,01,2026
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... Pad is designed with a hardness of Shore 30±5, providing high conductivity and excellent compression properties. It boasts a te...

Time : Jul,21,2026
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