tab bonding machine

LCD Screen Repairing 618sh Cof Product Description The COF also can do COF on flex cable, COF on f...

... : This equipment is suitable for all kinds of FPC, COF package, the combined dependend with LCD and PCB, is a professional for various size LC...

Thermode Pulse Heating Soldering Clients Feedback Features Hot Bar Soldering 1.Closed Loop PID temperature control...

2 head OLED QLED LCD TV panel screen COF ACF Home appliance repair LCD screen repair LCD TV repair. This is used i...

... lamination for notebook with Max tape size at 330x300mm NBL-1 Mylar lamination Advantages: 1: Easy to operate and control ,...

... , mainly applicable to capacitive touch screen (CTP), LCD module production and maintenance processes FPC, COF, combination with the L...

... Automatic ACF Film ACF Film Application: For a variety of high density ACF, , TCP crimping and FPC, FFC ...

Hot Bar Thermode Heating For Mobile Phone FPC FFC To LCD PCB Detailed Pictures : Specification: size 590x640x620 max.working area ...

..., which make following processings easier. The also suits for the processing of toys,beach sandals ect. that are with short plates f...

... Introduction: The thermal has a perforated- rotating drum, a wire-mesh drum cover layer and a wire-mesh looped conv...

... WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy w...

... Granule Worker: 2 Workers Output: 250-450kg/h Mat Width: 900mm-1800mm Plastic PVC Coil Cushion Mat / Manufacturing We will...

... hot melt adhesive Hot Melt Filter Element Paper hot melt adhesive General descripti...

... quantity of stock for Semiconductor related equipment. Among our featured are original and used ASM AB589 Series Rotary Head Fine Aluminu...

...e of PE foam sheet to nearly melting point via direct LPG flame. Then 2 pieces together. The ing force is by 2 rollers. No agent nor glue ...

Tesla 18650 Cylindrical Battery Pack Wire Bonding Machine,automatic spot welding machine price Equipment basic working principle: After the module ass...

... gold/copper wire (15–75μm diameter) to connect IC chips to lead frames or PCBs via thermosonic or ultrasonic , achieving ±1μm positioning a...

... foil and fiberglass cloth. Through high temperature hot pressing process, the two materials are tightly to form a composite material with h...

Thermal Bonded Wadding Production Line Nonwoven Thermal Bonding Production Line Thermal bonded wadding production line processes polyester fibers and ...