potting compound for electronic components

White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component TIS™680-12AB Series is a two-part silicone potting adhesive ...

Two-component clear silicone potting compound for electronic component ∎Product Description ●SI8125A/B is used in potting protection of varied compone...

● Product Features: Ø Double component, addition type. Ø Room temperature or heating curing. Ø High performance on insulation, damp proofing, vibratio...

TIS680-12AB Gray 1.2W/MK Two Compound Thermally Conductive Potting Compound For Electronic Component TIS™680-12AB Series is a two-part silicone pottin...

BAIYUN SDM401 Industrial Two-component Sealant Company Profiles Guangzhou Baiyun Chemical Industry Co., Ltd. was established in 1985, which is the fir...

2024 Two component silicone RTV gel glue potting machine for electronic component potting and casting We offers an automatic dosing machine for degass...

High Transmittance Low Temperature Conductive Adhesive Glue 0.3W / mK TIS™ 280-03AB is a two-component,high transmittance, high thermal conductive, lo...

Meter Mix Dispense Equipment Works For Potting Compound For Electronics Automatic glue filling machines are essential tools for the automatic proporti...

Special Electronic Potting Silicone Compound For Electronic Encapsulation Silicone Rubber Product Description Silicone compound is supplied as a two-c...

Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With OBC Attribute Value Test Method Composition Ceramic filler + Silicone - Co...

Epoxy Resin AB Glue Epoxy Potting Compound For Electronic Components Encapsulation Quick Detail: Name Epoxy Resin 1311 Usage Epoxy floor coatings Mixi...

Electronic Components Oven Stainless Steel Compound Balanced Belt Compound Balanced Belt Description Compound balanced belt is a varation of balanced ...

Clear Liquid Factory Glue Transformer BI Component Clear Epoxy Resin For APG Process And Electric Insulation Overview Essential details CAS No.: 1675-...

Complex process stamping wire line and bend forming line for electronic components Stamping Capability A: The min. pitch: 0.5mm B: Highest stamping sp...

Original Electronic Componants MAX5402EUA+T IC Integrated Circuits PRODUCT DESCRIPTION Digital Potentiometer ICs 256-Tap, uPoT Low-Drift, Digital Pote...

Strong Oxidation Resistance Palladium Plated Copper Wire For Manufacturing of Electronic Components The Pd coating also extends the Highly Accelerated...

​ Description: The electronic components (resistor and diode), coils, epoxy potting, and the ceramic head are all with good high temperature resistanc...

SI-46001-F Electronics Components Program ic Chip Memory IC LCD Controller ICs Feature • Glass Passivated Die Construction for High Reliability • Surg...

Liquid Flame Retardant Epoxy Resin For Medium High Voltage Insulation Switch Parts Product Description Bi-component Epoxy resin system/Liquid can be u...