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high thermal conductivity epoxy

1 - 20 Results for high thermal conductivity epoxy from 81663 Products

... encapsulant compound. lt is design for potting of capacitors and electricaldevices. TIE280-12AB-Series-Datasheet (2).pdf Feature > Good ther...

Time : Jan,16,2026
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We Supply Free Samples. OEM & ODM are Welcomed. we can do your logo and Brand Two-component solventless room temperature curing epoxy potting-sealing ...

Time : Jul,23,2025
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... 1.5W/Mk Resin Potting Compound Glue Product Summary: TIE™380-25 is a one component, heat cured ep...

Time : May,24,2025
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Performance One Component Glue for electronic potting compound Product Summary: TIETM380-25 is a one component, heat c...

Time : Dec,18,2024
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... for CT PT with Strength, Long Lasting and Durable, Strong Insulation Performance Bi-component alicyclic saturated s...

Time : Dec,21,2025
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Silicone For Electronics 2.0w/M·K Silicone Potting Compound Potting Factory Direct Supply Product Overvie...

Time : Jan,16,2026
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... electronic components heat plate Product features/Applications: cost performance, conductivi...

Time : Sep,05,2025
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pcb Lighting PCB MC PCB Aluminum pcb Power COB lights PCB led pcb PCB Type Material Type Material Brand Single side pcb...

Time : Dec,09,2024
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... Sealed Bead NTC Thermistor 30KOhm 3950 With UL4411 24AWG 2C 125C 300V Cable Overview The BetaCURVE Chip NTC Thermistor i...

Time : Nov,05,2025
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...Dosing System 2 Component Ab Mixing Dispensing Machine Silicone Compound Potting Machine Potting is a method for process...

Time : Dec,09,2024
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Single Part Fillers Dispensable Material for LED Discription of Single Part Fillers: Thermally Conducti...

Time : Apr,24,2025
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Bonded Fin Aluminum Heat Sink Material: 6063 T5 Aluminum Alloy Surface: Clear Anodised Advantages of aluminum ......

Time : Dec,09,2024
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... with resin, and carbon fiber prepreg. In the process of compression molding, carbon fiber prepreg is placed into mold, now the prepreg gets ...

Time : Apr,19,2025
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... versus deflection characteristics. The combination will allow minimal stress on components while also yielding low resistance. As a result...

Time : Dec,09,2024
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Low Volatility Silicone Pad For Industrial Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ...

Time : Dec,09,2024
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... dissipate heat generated by electronic components. These PCBs are made using aluminum as the base material, which has excellent thermal conductivi...

Time : Jan,16,2026
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...-Power Electronics Compound​ Simple attributes Dowsil TC-5860 is a one-part, gray, non-curing grease-like thermally conduc...

Time : Nov,27,2025
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..., derived from -sensitive-resistor, was coined to describe a form of resistive device that possesses a large temperaturecoefficient of res...

Time : Dec,09,2024
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... COS series device package Diamond copper composite material is composed of diamond and copper. It has the characteristics...

Time : Jun,18,2025
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