..., which make following processings easier. The also suits for the processing of toys,beach sandals ect. that are with short plates f...
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... for Samsung TV IC Replacement Acf Cof for Flex 616DH Heat Description Our LCD TV Panel Repair Machi...
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.../Coil Cushion Mat and Spike Layer Packing Detailed Product Description ry Name: PVC Coil Car Mat Production L...
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... That Used for Silicone Adhesive Silicone KANGLIBANG® Product Description Specialized for extrusion type silicone ...
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... WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy w...
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... hot melt adhesive Hot Melt Filter Element Paper hot melt adhesive General descripti...
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... quantity of stock for Semiconductor related equipment. Among our featured are original and used ASM AB589 Series Rotary Head Fine Aluminu...
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...e of PE foam sheet to nearly melting point via direct LPG flame. Then 2 pieces together. The ing force is by 2 rollers. No agent nor glue ...
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... gold/copper wire (15–75μm diameter) to connect IC chips to lead frames or PCBs via thermosonic or ultrasonic , achieving ±1μm positioning a...
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... Automatic ACF Film ACF Film Application: For a variety of high density ACF, TAB, TCP crimping and FPC, FFC ...
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... This is used to the pleated heavy duty air filter paper ends by hot melt.Tongchen Technology’s Heavy Duty Air Filter H...
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...uld use the Edge for edge. Equipment capacity: Depend on different human efficient :20 ~ 250 pcs / min Equipment size: 700*...
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... Car Cabin Air Filters Making 1, General Description This Continuously Edge is used to the edge of squa...
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... For Mobile Phone PCB Detailed Pictures : Thermode Hotbar Soldering Heating For Mobile Phone PCB Specification: size...
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... Programming Control Technology parameters Model CWPDY Depression (pa) 0.45-0.7 Working Area 200*260mm Fixture 1 set Control...
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Double Bonding Head Pulse Heat Bonding Machine With Double Working Modules Customer Feedback Double Bonding Head Pulse Heat Bonding Machine With Doubl...
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... with adhesive. Then the mixture is dropped into a standard size mold L2m×W1.55m×H1.2m where it goes under hydraulic pressure to shape foam....
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... Lock 'S Lunch Box Seal O Ring Material Product Description: The O Ring Manufacturing is an advanced automated r...
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...coated film, the layer is always applied before TiN/ZrN gold coating, which has an issue that from inside seeing through, it reflects the m...
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