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1 - 20 Results for color bond machine from 100001 Products

..., which make following processings easier. The also suits for the processing of toys,beach sandals ect. that are with short plates f...

Time : Dec,09,2024
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... for Samsung TV IC Replacement Acf Cof for Flex 616DH Heat Description Our LCD TV Panel Repair Machi...

Time : Dec,09,2024
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.../Coil Cushion Mat and Spike Layer Packing Detailed Product Description ry Name: PVC Coil Car Mat Production L...

Time : Dec,09,2024
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... That Used for Silicone Adhesive Silicone KANGLIBANG® Product Description Specialized for extrusion type silicone ...

Time : Nov,16,2025
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... WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy w...

Time : Jan,09,2026
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... hot melt adhesive Hot Melt Filter Element Paper hot melt adhesive General descripti...

Time : Dec,09,2024
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... quantity of stock for Semiconductor related equipment. Among our featured are original and used ASM AB589 Series Rotary Head Fine Aluminu...

Time : Dec,09,2024
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...e of PE foam sheet to nearly melting point via direct LPG flame. Then 2 pieces together. The ing force is by 2 rollers. No agent nor glue ...

Time : Dec,09,2024
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... gold/copper wire (15–75μm diameter) to connect IC chips to lead frames or PCBs via thermosonic or ultrasonic , achieving ±1μm positioning a...

Time : Jan,09,2026
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... Automatic ACF Film ACF Film Application: For a variety of high density ACF, TAB, TCP crimping and FPC, FFC ...

Time : Dec,09,2024
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... This is used to the pleated heavy duty air filter paper ends by hot melt.Tongchen Technology’s Heavy Duty Air Filter H...

Time : Dec,18,2025
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...uld use the Edge for edge. Equipment capacity: Depend on different human efficient :20 ~ 250 pcs / min Equipment size: 700*...

Time : Dec,09,2024
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... Car Cabin Air Filters Making 1, General Description This Continuously Edge is used to the edge of squa...

Time : May,19,2025
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... For Mobile Phone PCB Detailed Pictures : Thermode Hotbar Soldering Heating For Mobile Phone PCB Specification: size...

Time : Sep,29,2025
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... Programming Control Technology parameters Model CWPDY Depression (pa) 0.45-0.7 Working Area 200*260mm Fixture 1 set Control...

Time : Dec,09,2024
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Double Bonding Head Pulse Heat Bonding Machine With Double Working Modules Customer Feedback Double Bonding Head Pulse Heat Bonding Machine With Doubl...

Time : Dec,09,2024
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... with adhesive. Then the mixture is dropped into a standard size mold L2m×W1.55m×H1.2m where it goes under hydraulic pressure to shape foam....

Time : Dec,09,2024
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... Lock 'S Lunch Box Seal O Ring Material Product Description: The O Ring Manufacturing is an advanced automated r...

Time : Jan,09,2026
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...coated film, the layer is always applied before TiN/ZrN gold coating, which has an issue that from inside seeing through, it reflects the m...

Time : Jan,09,2026
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