bga ball

... industries, including , CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor production, Batteries, Small Metal Casting, Electron...

XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as...

Product Description: Wave Soldering Pallet The Wave Soldering Pallet is an essential tool for the wave soldering process in the electronics manufactur...

Product Description: The EMMC Memory Card is a high-performance storage solution designed to meet the demands of modern electronic devices such as pho...

.... This feature eliminates the need for manual alignment, reducing the risk of errors and increasing efficiency. The HD monitor provides a ...

...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module...

... footprint technologies. From standard FPGAs to complex Micro- (0.2mm pitch) and Package-on-Package (PoP) stacking, we possess the equipment an...

... Description Specification Max PCB Size W650*D610mm PCB Thickness 0.5-8mm Size 1*1-80*80mm Min. pitch 0.15mm Max Weight of 1000g Placem...

BGA TEST SOCKET HOUSING KR-8090-SP Material: Aluminum Alloy Surface Treatment: Anodizing Color: customized Tolerance: ± 0.03mm Support and Services: O...

... Grid Array () components. It enables the removal and replacement of components on printed circuit boards (PCBs), allowing for repairs a...

... Line Machine Repair Machine Camera observe the melting process of solder and precisely Performance indicators and specifications par...

... components on printed circuit boards (PCBs). components are surface-mount integrated circuits (ICs) that have a grid of solder on th...

...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A ...

... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS -Grid-Array () modules in the market. The low profile and small s...

...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A ...

IS42S32800J-6BLI-TR ISSI DRAM 256M, 3.3V, SDRAM, 8Mx32, 166Mhz, 90 (8mmx13mm) RoHS, IT, T&R...

...-10TLI 1Mx16 High-Speed 10ns SRAM 3.3V Operation Low Power Industrial Temp (-40anddeg;C to +85anddeg;C) 48- Package Asynchronous Operation ...

THGBMNG5D1LBAIT KIOXIA AMERICA INC NAND Flash Serial 4GB 2.7 to 3.6V 153- - Trays (Alt: THGBMNG5D1LBAIT) Manufacturer:Kioxia Product Category:...

PCBA Board Fabrication Ball Grid Array Bga Pcb Assembly Quick Turn prototype and mass production PCB FASTPCBA dedicated in manufacturing 1-48 layers q...

... PCB'A FR4 PCB Circuit Board Double Side PCB Assembly Double Side PCB Assembly Introduction The double-sided printed circuit board (also double-...