bga ball

... industries, including , CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor production, Batteries, Small Metal Casting, Electron...

XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as...

Product Description: Wave Soldering Pallet The Wave Soldering Pallet is an essential tool for the wave soldering process in the electronics manufactur...

Product Description: The EMMC Memory Card is a high-performance storage solution designed to meet the demands of modern electronic devices such as pho...

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.... This feature eliminates the need for manual alignment, reducing the risk of errors and increasing efficiency. The HD monitor provides a ...

... Assembly – Fine-Pitch & Grid Array Overview Grid Array () components are at the heart of modern high-density electronics—enabling ...

BGA Rework Station for Mobile Phone CCD Color Optical Alignment System 0.01mm Mounting Accuracy 1℃ Temperature Accuracy Product Overview The Mobile Ph...

...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module...

... footprint technologies. From standard FPGAs to complex Micro- (0.2mm pitch) and Package-on-Package (PoP) stacking, we possess the equipment an...

... Description Specification Max PCB Size W650*D610mm PCB Thickness 0.5-8mm Size 1*1-80*80mm Min. pitch 0.15mm Max Weight of 1000g Placem...

Industrial eMMC 5.1 153 Embedded Chips Industrial-grade eMMC 5.1 embedded chips featuring 153- packaging with capacities of 64GB, 128...

..., China factory. assembly represents the most demanding category of SMT manufacturing, where hundreds or thousands of solder connections h...

... Test & Burn-In Sockets Product Overview 3M Textool Test & Burn-In Sockets, with a 1.00 mm pitch, are designed for reliable testing and burn...

... Line Machine Repair Machine Camera observe the melting process of solder and precisely Performance indicators and specifications par...

... PCB Assembly (0.25 mm Pitch) Huayihai provides PCB assembly for packages with pitches down to 0.25 mm. Because joints sit undernea...

... Grid Array 10-Layer PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the picture and param...

... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS -Grid-Array () modules in the market. The low profile and small s...

... Grid Array 10-Layer PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the picture and param...

...-10TLI 1Mx16 High-Speed 10ns SRAM 3.3V Operation Low Power Industrial Temp (-40anddeg;C to +85anddeg;C) 48- Package Asynchronous Operation ...