aln substrate properties

... are essential components widely used in various high-performance applications due to their exceptional thermal, mechanical, and electric...

... conductivity and electrical insulation , enabling efficient heat dissipation. The finished board thickness is 1.5mm, and both the inner ...

Chip Terminations 50Ω 5w DC- 6GHz BeO Al2O3 1.27 * 2.54 Standard Resistance: 50Ω Material: BeO, ,Al2O3 Resistance Tolerance: ±5%(def...

... single crystal wafers Applications of template Silicon-based semiconductor technology has reached its limits and could not sa...

... Ceramic , High Thermal Conductivity 0.5mm Ceramic,6inch ceramic Introduce The aluminum nitride () ceramic has hi...

... the most widely used materials are Alumina (Al2O3), Aluminum Nitride (), and Silicon Nitride (Si3N4), each offering a unique set of ...

... We provides ceramic is one of the most popular ceramic which has excellent heat resistance, high...

... Thermal Conductivity Aluminum Nitride Ceramic Wafer The specification of the Ceramic wafer 1. We are supplying with many round ceramic waf...

... insulation performance, excellent mechanical , non-toxic, high temperature resistance, chemical corrosion. It is widely used in differen...

... DC9V DC9V CIRCUIT 3S2P 3S1P 3S1P*2 Chips F55 F60 F55 VIEW ANGLE 120° 120° 120° Coppering Coppering Coppering WHOLE SIZE 7.0x...

Gray Alumina-Nitride-Ceramic Parts With Flexural Strength ≥330MPa High Ceramic TO220 Package Product Description: Aluminum Nitride Ceram...

... conductivity of , about 8 times that of alumina, is the primary reason for its selection in these applications. While beryllium oxide has even ...

Vacuum brazing furnace for AMB bonding of ceramic substrates This equipment is used for AMB copper cladding process of Si3N4 and Aln substrates.It can...

... FR-4 and even Metal Core PCBs (MCPCB) fail to meet thermal and electrical insulation requirements. DuxPCB utilizes advanced ceramic lik...

... Ceramic Printed Circuit Board , 0.6MM , 30UM Copper 1 Layer Ceramic PCB PCB Specifications: Layer Count: 1 Layer Ceramic PCB Board Thicknes...

... / semiconductor / electronic industries. One typical application is Ceramic Radiating . Cooper conductive film deposition on Al2O3, , ...

2 inch AlN Templates: Dimensions:Ф 50.8 mm ± 0.1 mm Substrate:Sapphire (Single Side Polished) Thickness:4 ~ 5 µm Orientation:C-plane (0001) ± 1° Condu...

... For GaN Power Amplifier PAM-XIAMEN’s Template Products consist of crystalline layers of gallium nitride (GaN), aluminum nitride (),al...

... High Pressure Experimental Phase Round LaAlO3 Wafer Optical High Pressure Experimental Phase Double Side Polished LaAlO3 is a h...

... 7. Good Wear resistance 8. High fracture toughness 9. Shapes and size can be produced according to your requirements Product Description The Alumi...