0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices
Brand Name:TOPCBS
Certification:UL94V0
Model Number:BIB and test Boards
Minimum Order Quantity:Negotiation
Delivery Time:10-14working days
Payment Terms:T/T
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Suzhou Jiangsu China
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Room 301, Building 1, Shahu Science and Technology Park, SIP, SUZHOU City,Jiangsu Province,P.R.C
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0.35pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board
Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and are designed to withstand the hot temperatures during tests.
Burn in boards utilize high grade materials. For testing up to 125C a special version of FR4 is used (High Tg FR4). For higher temperatures up to 250C a Polyimide is used; and for very high temperatures up to 300C a High grade polyimide is used.
1 . Descriptions:
What is a BIB ?
A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.
2 . Specifications:
| Name | 0.35pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards |
| Number of Layers | 8 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | IT180 |
| Thickness | 0.8mm |
| Min Track/Spacing | 75um/75um |
| Min Hole Size | Laser 75um |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold + OSP |
| Finished Copper | 12um |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices
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