High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

Brand Name:TOPCBS
Certification:UL94V0
Model Number:BIB and test Boards
Minimum Order Quantity:Negotiation
Delivery Time:10-14working days
Payment Terms:T/T
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Location: Suzhou Jiangsu China
Address: Room 301, Building 1, Shahu Science and Technology Park, SIP, SUZHOU City,Jiangsu Province,P.R.C
Supplier`s last login times: within 22 hours
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Product Details

0.25 pitch 12Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board


  • Reduced product development time
  • Increased customer confidence
  • 100% product quality and reliability
  • A forecast life expectancy
  • Reduced circuit board manufacturing costs
  • Increased profitability
  • Reduced after sales service

1 . Descriptions:


What is a BIB ?


A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.


2 . Specifications:


Name0.25pitch 12Layer HDI PCBs for Burn in boards and semiconductor Test boards
Number of Layers12
Quality GradeIPC 6012 Class 2,IPC 6012 Class 3
MaterialIT180
Thickness0.7mm
Min Track/Spacing75um/75um
Min Hole SizeLaser 75um
Solder MaskGreen
SilkscreenWhite
Surface FinishImmersion gold + OSP
Finished Copper12um
Production time10-21 working days
Lead time2-3 days

China High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer supplier

High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

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