ENIG Peelable Solder Special PCB Board 4 Layer For Mobile Phones
Brand Name:FASTPCB
Minimum Order Quantity:10PCS
Place of Origin:CHINA
Price:USD 0.01-100PCS
Supply Ability:10PCS+48Hour(production time )
Packaging Details:Corrugated case
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Location:
Shenzhen Guangdong China
Address:
Building B, Shangxing West Industrial Zone, No. 1001, West Ring Road, Shajing street, Bao'an District, Shenzhen, Guangdong, China
Supplier`s last login times:
within 23 hours
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Product Details
ENIG + Peelable Solder Special Process PCB
ENIG + Peelable Solder Special Process PCB is a special process printed circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd., which is made of FR-4 material and surface gold deposition. The minimum line width and line spacing can reach 75 / 75um and the minimum aperture can reach 0.2mm. The circuit board is widely used in mobile phones, laptops, automobiles, tablet computers and other fields.
HDI Advanced Technology
Item | HDI Advanced Technology | |||
2019 | 2020 | 2021 | ||
Structure | 5+n+5 | 6+n+6 | 7+n+7 | |
HDI Stack Via | AnyLayer(12L) | AnyLayer(14L) | AnyLayer(16L) | |
Board Thickness(mm) | Min. 8L | 0.45 | 0.4 | 0.35 |
Min. 10L | 0.55 | 0.45 | 0.4 | |
Min. 12L | 0.65 | 0.6 | 0.55 | |
MAX. | 2.4 | |||
Min. Core Thickness ( um ) | 50 | 40 | 40 | |
Min. PP Thickness ( um ) | 30(#1027PP) | 25(#1017PP) | 20(#1010PP) | |
Base Copper Thickness | Inner Layer ( OZ) | 1/3 ~ 2 | 1/3 ~ 2 | 1/3 ~ 2 |
Outer Layer ( OZ ) | 1/3 ~ 1 | 1/3 ~ 1 | 1/3 ~ 1 | |
Item | HDI Advanced Technology | |||
2019 | 2020 | 2021 | ||
Min. Mechanical Drill hole size(um) ** | 200 | 200 | 150 | |
Max. Through Hole Aspect Ratio * | 8:1 | 10:1 | 10:1 | |
Min. Laser via/Pad Size ( um ) | 75/200 | 70/170 | 60/150 | |
Max. Laser Via Aspect Ratio | 0.8:1 | 0.8:1 | 0.8:1 | |
Laser Via on PTH(VOP)design | Yes | Yes | Yes | |
Laser X type through hole(DT≤200um) | NA | 60~100um | 60~100um | |
Min. LW/S (L/S/Cu, um) | Inner Layer | 45 /45 /15 | 40/ 40/ 15 | 30/ 30 /15 |
outer Layer | 50 /50/ 20 | 40 /50 /20 | 40 /40 /17 | |
Min BGA Pitch (mm) | 0.35 | 0.3 | 0.3 | |
Item | HDI Advanced Technology | |||
2019 | 2020 | 2021 | ||
Solder mask Registration (um) | +/- 30 | +/- 25 | +/- 20 | |
Min. Solder Mask Dam (mm) | 0.07 | 0.06 | 0.05 | |
PCB Warpage Control | >= 50ohm | +/-10% | +/-8% | +/- 5% |
< 50ohm | +/- 5ohm | +/- 3ohm | +/- 3ohm | |
PCB Warpage Control | ≤0.5% | ≤0.5% | ≤0.5% | |
cavity Depth accuracy (um) | Mechanical | +/- 75 | +/- 75 | +/- 50 |
Laser directly | +/- 50 | +/- 50 | +/- 50 | |
Surface Finishing | OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag | OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG | ||
HLC Advanced Technology
Item | HLC Advanced Technology | |||
2019 | 2020 | 2021 | ||
Max Panel Width (inch) | 25 | 25 | 25 | |
Max Panel Length (inch) | 29 | 29 | 29 | |
Max Layer Count (L) | 16 | 18 | 36 | |
Max Board thickness (mm) | 3.2 | 4 | 6 | |
Max Board thickness Tolerance | +/-10% | +/-10% | +/-10% | |
Base copper Thickness | Inner layer ( OZ ) | 4 | 6 | 8 |
Outer Layer ( OZ ) | 2 | 3 | 4 | |
Min DHS ( mm ) | 0.2 | 0.15 | 0.15 | |
PTH Size Tolerance ( mil ) | +/-2 | +/-2 | +/-2 | |
Back Drill (stub)( mil ) | ~ 3 | ~ 2.4 | ~ 2 | |
Max. AR | 12:1 | 16:1 | 20:1 | |
Item | HLC Advanced Technology | |||
2019 | 2020 | 2021 | ||
M-drill tolerance | Inner layer ( mil ) | DHS + 10 | DHS + 10 | DHS + 8 |
Outer Layer ( mil ) | DHS + 8 | DHS + 8 | DHS + 6 | |
Solder mask Registration (um) | +/- 40 | +/- 30 | +/- 25 | |
Impedance control | ≥50ohms | +/-10% | +/-10% | -/-8% |
<50ohms | 5 Ω | 5 Ω | 4 Ω | |
Min LW/S (Inner)@1oz base Cu ( mil ) | 3.0 / 3.0 | 2.6 / 2.6 | 2.5 / 2.5 | |
Min LW/S (Outer)@1oz Cu ( mil ) | 3.5 / 3.5 | 3.0 / 3.5 | 3.0 / 3.0 | |
Max dimple for POFV ( um ) | 30 | 20 | 15 | |
Surface Finishing | ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au | |||
Packaging & Delivery | |||||
Packaging Details: | Inner: vacuum packing or Anti-static package, | ||||
Port: | Shenzhen or Hongkong | ||||
Lead Time: | Quantity(Pieces) | 1-10 | 11-100 | 101-1000 | >1000 |
Est. Time(days) | 20 | 21 | 25 | To be negotiated | |
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication,
SMT, plastic injection & metal,final assembly, testing and
other value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic
requirements(material,size, surface finish treatment, copper
thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side
local law and promising tokeep customers data in high confidential
level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home,
Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can
support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China
ENIG Peelable Solder Special PCB Board 4 Layer For Mobile Phones
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