5g Antenna Pcb 5ghz Motherboard Hdi Circuit Board And Components

Minimum Order Quantity:10PCS
Price:USD 0.01-100PCS
Supply Ability:10PCS+15DAY(production time )
Packaging Details:Corrugated case
PCB:5G Equipment PCB
Base Material:FR-4 TG170
Contact Now

Add to Cart

Active Member
Location: Shenzhen Guangdong China
Address: Building B, Shangxing West Industrial Zone, No. 1001, West Ring Road, Shajing street, Bao'an District, Shenzhen, Guangdong, China
Supplier`s last login times: within 23 hours
Product Details Company Profile
Product Details

5G Equipment PCB


5th Generation Mobile Communication Technology (5G) is a new Generation of broadband Mobile Communication Technology with the characteristics of high speed, low delay and large connection. It is the network infrastructure to realize man-machine interconnection.


ItemHDI Advanced Technology
201920202021
Structure5+n+56+n+67+n+7
HDI Stack ViaAnyLayer(12L)AnyLayer(14L)AnyLayer(16L)
Board Thickness(mm)Min. 8L0.450.40.35
Min. 10L0.550.450.4
Min. 12L0.650.60.55
MAX.2.4
Min. Core Thickness ( um )504040
Min. PP Thickness ( um )30(#1027PP)25(#1017PP)20(#1010PP)
Base Copper ThicknessInner Layer ( OZ)1/3 ~ 21/3 ~ 21/3 ~ 2
Outer Layer ( OZ )1/3 ~ 11/3 ~ 11/3 ~ 1
ItemHDI Advanced Technology
201920202021
Min. Mechanical Drill hole size(um) **200200150
Max. Through Hole Aspect Ratio *8:110:110:1
Min. Laser via/Pad Size ( um )75/20070/17060/150
Max. Laser Via Aspect Ratio0.8:10.8:10.8:1
Laser Via on PTH(VOP)designYesYesYes
Laser X type through hole(DT≤200um)NA60~100um60~100um
Min. LW/S (L/S/Cu, um)Inner Layer45 /45 /1540/ 40/ 1530/ 30 /15
outer Layer50 /50/ 2040 /50 /2040 /40 /17
Min BGA Pitch (mm)0.350.30.3
ItemHDI Advanced Technology
201920202021
Solder mask Registration (um)+/- 30+/- 25+/- 20
Min. Solder Mask Dam (mm)0.070.060.05
PCB Warpage Control>= 50ohm+/-10%+/-8%+/- 5%
< 50ohm+/- 5ohm+/- 3ohm+/- 3ohm
PCB Warpage Control≤0.5%≤0.5%≤0.5%
cavity Depth accuracy (um)Mechanical+/- 75+/- 75+/- 50
Laser directly+/- 50+/- 50+/- 50
Surface FinishingOSP,ENIG,Immersion Tin,Hard Au, Immersion AgOSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

Packaging & Delivery
Packaging Details:Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.
Port:Shenzhen or Hongkong
Lead Time:Quantity(Pieces)1-1011-100101-1000>1000
Est. Time(days)202125To be negotiated

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.


Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.


Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.


Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.


Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.


Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

China 5g Antenna Pcb 5ghz Motherboard Hdi Circuit Board And Components supplier

5g Antenna Pcb 5ghz Motherboard Hdi Circuit Board And Components

Inquiry Cart 0