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Laser Direct Imaging PCB Solder Mask For PCB、HDI、FPC With File Format

Laser Direct Imaging PCB Solder Mask For PCB、HDI、FPC With File Format

Brand Name:GIS
Model Number:DPX820SM
Place of Origin:Suzhou, China
Laser power:Mixing Wave Total Power 512W
Scale mode:White, Black, Yellow, Etc.
Solder bridge/solder opening:50/75μm(process Condition)
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Location: Suzhou China
Address: Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
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Product Details

Laser Direct Imaging PCB Solder Mask Application For PCB,HDI,FPC With File Format

Product Description:

Laser Direct Imaging Printed Circuit Board (LDIPCB)

Laser Direct Imaging Printed Circuit Board (LDIPCB) is a reliable and widely used technology for the manufacture of Printed Circuit Boards (PCB). It makes use of laser imaging to transfer a PCB design onto the circuit board. This technology offers the advantages of high accuracy, low cost and fast turnaround time. The effective exposure area of LDIPCB is 620x720mm, with an alignment accuracy of ±12um, and line width tolerance of ±10%. It is applicable for solder mask and outer processes, and supports file formats including Gerber, ODB++ and Cals.
LDIPCB provides the highest level of precision and accuracy for PCB manufacturers, enabling them to produce high-quality and reliable PCBs with a quick turnaround time. It eliminates the need for complex and costly processes, such as silkscreen printing and etching. This makes it an ideal choice for PCB manufacturing, and is widely used in a variety of industries, including consumer electronics, automotive, and medical.
Laser Direct Imaging Printed Circuit Board (LDIPCB) is the perfect solution for those looking for a reliable, high-quality and cost-effective PCB manufacturing solution. It offers superior accuracy and precision, with no need for complex and costly processes. It is an ideal choice for PCB manufacturers who need to produce high-quality and reliable PCBs with a quick turnaround time.

Features:

  • Product Name: Laser Direct Imaging PCB
  • Board thickness: 0.5~3.5mm
  • Application: PCB,HDI,FPC
  • Laser power: Mixing Wave Total Power 512W
  • File format: File Format
  • Scale mode: White, Black, Yellow, Etc.
  • Laser Direct Imaging Printed Board
  • Laser Direct Imaging Circuit Board
  • Laser Direct Imaging Circuit Board Manufacturing

Technical Parameters:

ParameterSpecification
Solder Mask ColorFixed Scale/ Auto Scale / Interval Scale / Partition Alignment
Laser PowerMixing Wave Total Power 512W
Line width tolerance±10%
Alignment accuracy±12um
File formatFile Format
ApplicationPCB,HDI,FPC
Effective exposure area620x720mm(24
Board thickness0.5~3.5mm
Scale modeWhite, Black, Yellow, Etc.
Solder mask ink30s@600x500mm(24

Applications:

GIS DPX820SM Laser Direct Imaging Print Board has become a popular choice for many applications due to its precision and reliability. This product is made by Suzhou, China and usually used in Solder Mask, Outer process. It features 50/75μm solder bridge/solder opening and 30s@600x500mm solder mask ink. The alignment method is PAD with diameter of 0.5~3.0mm and File Format for the files.
GIS DPX820SM Laser Direct Imaging Printed Board is highly suitable for applications which require high precision and reliability. It is widely used in the automotive, aviation, and aerospace industries. It is also used in medical, industrial, and consumer electronics. With its high accuracy and performance, this product can be used for the production of high-precision products such as PCBs, electronic components, and other components.
GIS DPX820SM Laser Direct Imaging Circuit Board is the perfect choice for manufacturers who need to produce complex circuit boards with high accuracy. Its advanced laser direct imaging technology makes it possible to produce extremely precise components. It also offers great flexibility in terms of design. Its high speed and high resolution make it the ideal choice for complex circuitry and complex components.
GIS DPX820SM Laser Direct Imaging Print Board is the ideal choice for those who need a reliable and accurate product for their PCB manufacturing needs. With its superior quality and performance, this product can provide an efficient and cost-effective solution for any application. Whether you are looking for a product to use in soldering, outer process, or any other application, GIS DPX820SM Laser Direct Imaging Printed Board is the perfect choice.

Customization:

GIS Laser Direct Imaging Printed Circuit Board (DPX820SM)

GIS Laser Direct Imaging Printed Circuit Board (DPX820SM) is a reliable and robust printed circuit board solution. It is produced in Suzhou, China and features scale mode options such as white, black and yellow. It also has 30s@600x500mm(24 solder mask ink and PAD alignment method (diameter: 0.5~3.0mm). The board thickness range is 0.5~3.5mm and the line width tolerance is ±10%.

GIS Laser Direct Imaging Printed Circuit Board Key Features
  • Laser Direct Imaging Printed Circuit Board
  • Laser Direct Imaging Printed Circuit Board
  • Laser Direct Imaging Circuit Board
  • GIS DPX820SM
  • Manufactured in Suzhou, China
  • Scale mode options: White, Black, Yellow, etc.
  • 30s@600x500mm(24 solder mask ink
  • PAD alignment method (diameter: 0.5~3.0mm)
  • Board thickness range: 0.5~3.5mm
  • Line width tolerance: ±10%

For more information about GIS Laser Direct Imaging Printed Circuit Board (DPX820SM), please contact us.

Support and Services:

Laser Direct Imaging (LDI) PCB technology provides customers with technical support and services to ensure the quality and reliability of their products.
Technical Support: Our experienced engineers are always available to assist customers with any technical questions they may have. We can provide technical advice and recommendations to ensure that customers’ products are of the highest quality. We also provide on-site support when necessary.
Services: Our services include product testing, troubleshooting and repair. We use the latest testing equipment and techniques to ensure that our customers’ products meet their requirements. We also offer repair services when necessary. We strive to provide the best possible service to our customers.

Packing and Shipping:

Packaging and Shipping for Laser Direct Imaging PCB:
The Laser Direct Imaging PCB will be packed in a strong cardboard box with protective packaging materials such as bubble wrap and foam to prevent any potential damage during transportation. The box will be sealed with strong adhesive tape. The package will then be shipped via a reliable courier with tracking capability.

FAQ:

A1: The brand name of Laser Direct Imaging PCB is GIS.
A2: The model number of Laser Direct Imaging PCB is DPX820SM.
A3: The place of origin of Laser Direct Imaging PCB is Suzhou, China.
A4: Laser Direct Imaging PCB has high production efficiency, strong environmental adaptability, free debugging, and cost savings.
A5: Laser Direct Imaging PCB is widely used in the production of various types of high-precision printed circuit boards.
China Laser Direct Imaging PCB Solder Mask For PCB、HDI、FPC With File Format supplier

Laser Direct Imaging PCB Solder Mask For PCB、HDI、FPC With File Format

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