ISO 9001 CE LDI Laser Direct Imaging PCB 0.05mm-3.5mm
Brand Name:GIS
Certification:ISO 9001 CE
Model Number:DPX230
Minimum Order Quantity:1 set
Delivery Time:20 work days
Place of Origin:Jiangsu, China
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Location:
Suzhou China
Address:
Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
Supplier`s last login times:
within 28 hours
Product Details
Company Profile
Product Details
laser direct imaging (LDI) system solutions for various PCB Multilayer
Circuit Pattern Imaging Challenge
Under the increasing demand for miniaturization and better functionality of electronic components and devices, and the trend of smaller and denser chips, printed circuit boards (PCBs) have been shrinking in size, which drive PCB designers to design high density interconnect (HDI) boards, and put PCB manufacturers to fabricate fine-pitch circuit boards, and make sure all the circuitry is running off these smaller chips.
While, this demand brings a lot of challenges on HDI PCB manufacturing technology, especially in circuit pattern imaging. Laser Direct Imaging (LDI) for patterning enable to achieve the best imaging results for printed circuit boards with fine lines and ultra-fine lines.
PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by
what is the imaging process. Laser direct imaging ( LDI ) exposes
the traces directly with a highly focused laser beam that in NC
controlled, instead of flooded light passing through a photo tool,
a laser beam will digitally create the image.
How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface
that is positioned under a computer controlled laser. And then the
computer is creating the image on the board with the light of
laser. A computer scans the board surface into a raster image,
matching the raster image to a pre-loaded CAD or CAM design file
that includes the specifications for the necessary image intended
for the board, the laser is used for directly creating the image on
the board.
| Specification/model | DPX230 |
| Application | PCB,HDI,FPC (inner layer,outer layer,anti-welding) |
| Resolution (mass production) | 30um |
| Capacity | 30-40S@18"*24" |
| Exposure Size | 610*710mm |
| Panel thickness | 0.05mm-3.5mm |
| Alignment Mode | UV-Mark |
| Alignment capability | Outer layer±12um；Inner laye±24um |
| Line width tolerance | ±10% |
| Deviation increase and decrease mode | Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment |
| Laser type | LD Laser,405±5nm |
| File format | Gerber 274X；ODB++ |
| Power | 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10% |
| Condition | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%;
Cleanliness level 10000 and above; Vibration requirements to avoid violent vibration near the equipment |
About us
We are an innovative supplier of various PCB laser direct imaging
(LDI) system solutions. Our system product portfolio ranges from
LDI system configurations for high-mix and emerging PCB niche
applications to fully automated LDI system solutions for mass
production environments.
ISO 9001 CE LDI Laser Direct Imaging PCB 0.05mm-3.5mm
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