400nm To 410nm Laser Direct Imaging 133LPI Decal Heat Transfer

3D Glass Cover Panel LDI Laser Direct Image Exposure Machine For Vehicle Glass

In the world of PCB Manufacturing, it is important to stay as up-to-date as possible with industry trends. This is because, circuit boards are constantly evolving and getting more complex, due to miniaturization trends in the electronics industry. These changes have caused the traditional imaging process for HDI PCBs to provide inadequate results.

In response to new electronics tendencies, the PCB manufacturing industry has come up with a new imaging technique known as Laser Direct Imaging. Below you will find an introductory guide to this process.

Advanced Automation Line for 3D Cover Glass

This automation line is used to produce BM patterning process on 3D glass for smart phone;

3D raw glass material input by fully equipped automatic loading machine, followed by plasma cleaner, automatic spraying machine, tunnel oven, DLP exposure machine, developing and washing machine, final goods output by unloading machine;

Up to 30um resolution, over 95% of yield, thinning BM layer that easier for assembly, higher pattern quality and lower cost of ownership for customers;

*Specifications subject to change without notice

About US

GIS Intelligent Inc., subsidiary corporation of GIS Tech Inc., focusing on advanced solution for Lithium battery fabrication and 3D cover glass patterning. GIS Tech Inc. was established by founders from U.S in 2015, Suzhou China, developing Digital Lighting Processing (DLP) specially for different industry patterning solution needs, which enable MEMS/Glass /PCB/Screen printing manufacturers to achieve the best imaging results with the highest throughput.

We are the leader in automation solution for 3D cover glass in the world, which was used to produce high quality BM patterning on large curvature glass by DLP photolitho. Our DLP systems powered by Dr. Takeda, together with GIS’s semiconductor laser diodes technologies to achieve enhanced Depth-of-Focus for 3D topography changes, as well as patterning uniformity.

The core team of GIS Tech come from the top 500 international companies from the United States. Based on over 20 years experience of semiconductor technology, automation and materials teams, we fully understand and master the industry‘s development trend and cutting-edge technology. Our expertise in transferring patterns on cover glass materials at high curvature level and irregular shaped enables customers to transform possibilities into reality, especially for 3C smart electronics and automobile cover glass.

Jiangsu GIS Laser Technologies Inc. (hereafter referred to as GIS Laser) is a subsidiary of GIS Tech Inc. which is a multinational company providing advanced intelligent solutions in to the industries of New Energy, Semiconductor Packaging, Lithium Battery, PCB and Printing, with its incredible innovation. through its independent Next Tech Research Institute, Business Division and Manufacturing Plant.

Our mission is to be a professional supplier in product solutions and services, striving for sustainable optimization and innovation in manufacturing capabilities for customers.

Our values are following with innovation, humility, perseverance, commitment.

GIS Tech has a strong professional R&D and after sales team with over 30 years experiences to enable the annual production output to be over 500 units, based on its professional manufacturing management SOP process through 10,000 square meter manufacturing center in Xuzhou city, Jiangsu province.

GIS Tech is the pioneer in introducing the DLP Technology into the laser imaging applications, owning the whole independent intellectual properties in the technologies of data processing, data transmission, sub-graph, electronic control, board card control, laser and optical lens etc. Our main products are CTS series (Computer to Screen system), CTP (Computer to Plate system) and fully automatic printing plate developing system.

GIS Tech is prepared to meet with new challenges in funding, technology, teams, applications, services, supply chains in the new future.