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12mil FR4 Flex Electronic Circuit Boards 4 Layer HDI High Frequency

12mil FR4 Flex Electronic Circuit Boards 4 Layer HDI High Frequency

Brand Name:Huashengxin
Certification:UL , ISO9001
Model Number:ED9A8122
Minimum Order Quantity:1pcs
Delivery Time:fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production
Payment Terms:T/T
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Location: Shenzhen Guangdong China
Address: RM1510, YUNHUA TIMES, Shajing Street, Baoan District, Shenzhen,Guangdong, China
Supplier`s last login times: within 25 hours
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Product Details

12mil FR4 Flex Electronic Circuit Boards 4 Layer HDI High Frequency​


Flex PCB Board Custom PCB Manufacturing Circuit Board Assembly Services Electronic Circuit Board Assembly


4 Layer Flex Printed Circuit Board


Flexible printed circuits are circuit boards that have the ability to bend or twist. From this assertion, it is obvious that they are distinguished by a flexible construction. That is why electronic engineers and designers use them in applications that demand for their qualities. They are also referred to as flex circuits and are mostly used in small electronic applications. Since they are characterized by their ability to bend, flexible printed circuits are made of flexible substrate such as polyimide. Another important quality of flexible printed circuits is that they have superior heat dissipation than printed circuit boards. It is this quality that makes it possible for the electronics that use it to stay in quality condition for a long time.


HSX products cover 1~32L FR4 PCB, IMS PCB,HDI Boards, high frequency PTFE boards and Rigid-flex boards etc. It provides flexible quick turn production services (12 hours to72 hours), as well as small volume to big volume PCB manufacturing.Products are widely used in high-tech fields such as communications, power supplies, computer networks, digital products, industrial control, science and education, medical devices, and aerospace.


FPC Technology Capability
Attribute (All dimensions are mils unless
otherwise specified)
Mass Production (Yield
80%,Cpk1.33)
Small Amount(Yield60%, Key
Specification Yield80%
Sample
FPC(yes/no)yesyesyes
Layer count/Structure, Max.246
Size(L×W), Max.550mm*250mm550mm*250mm700mm*250mm
Nominal thickness (mm)0.1~0.50.1~0.50.1~0.8
Thickness tolerance±10%(>0.3mm)/±0.03mm(0.3mm)±10%(>0.3mm)/±0.03mm(0.3mm)±10%(>0.3mm)/±0.03mm(0.3mm)
Surface finish typeENIGENEPIGOPSI-SilverI-Tin HASLHard GoldENIGENEPIGOPSI-SilverI-Tin HASLHard GoldENIGENEPIGOPSI-SilverI-Tin HASLHard Gold
Soft ENIG(yes/no)nonono
Base material typePIPIPILCPTK
Coverlay thickness (um)28/50/60/8028/50/60/8028/50/60/80
Adhesive thickness (um)25/40/50/6525/40/50/6525/40/50/65
Copper thickness, Min./Max. (um)12-7012-7012-70
Base material thickness, Min./Max. (um)25-7525-7525-100
Mechanical drilled thru-hole size (DHS), Min.0.150.150.15
Plating aspect ratio, Max.3:13:15:1
Pad size, Min.With through hole:0.4mm
Without through hole:0.2mm
With through hole:0.4mm
Without through hole:0.2mm
With through hole:0.3mm
Without through hole:0.2mm
Pad size tolerance20%20%10%
Pad to pad space, Min.4mil4mil4mil
Pad to outline tolerance±3mil±3mil±2mil
Pattern location accurancy±3mil±3mil±2mil
Pattern location accurancy from top side to bottom±3mil±3mil±2mil
Laser via hole diameter/pad, Min.4/12mil4/10mil4/10mil
Outerlayer(Hoz+plating) line width/space, Min.3/3mil3/3mil2/2mil
Innerlayer(Hoz) line width/space, Min.3/3mil3/3mil2/2mil
Inner line width tolerance±10%±10%±10%
Outerlayer registration, Min. (Pad diameter = DHS + X)DHS + 8DHS + 8DHS + 6
Innerlayer registration, Min. (Pad diameter = DHS + X)(L4 layer)DHS + 10DHS + 10DHS + 8
Laser via hole pitch, Min.0.40mm0.40mm0.35mm
Mechanical hole pitch, Min.0.50mm0.50mm0.40mm
Drilled hole position tolerance±2mil±2mil±2mil
Hole size tolerance±2mil±2mil±2mil
Location accurancy from tooling hole(PTH&NPTH) to pad±3mil±3mil±2mil
Location accurancy from tooling hole(PTH&NPTH) to outline±3mil±3mil±2mil
Outline size tolerance±2mil±2mil±2mil
LPI registration/dam, Min.2mil/4mil2mil/4mil2mil/3mil
LPI dam on CVL8mil8mil8mil
Coverlay open window/damΦ0.5mm/0.3mmΦ0.5mm/0.3mmΦ0.3mm/0.2mm
Coverlay registration/Resin flow4mil4mil2mil
Stifferness materialFR4/PI/SteelFR4/PI/SteelFR4/PI/Steel
Stifferness dam, Min.12mil12mil8mil
Stifferness registration/Resin flow8mil/4mil8mil/4mil4mil/2mil
Impedance tolerance10%10%5%
Thermal reliability(LPI, FCCL, CVL)288°/10s/3times288°/10s/3times288°/10s/3times
Qualified material and structure ULPIPIPI

FAQ:


Q1:Are you a factory or trade company?
A: Yes, we are the factory, we have independent quick turn prototype PCB manufacturing & big volume PCB production lines.


Q2:How about your PCB factory production capacity?
A: Our monthly production capacity is 50,000 square meter/month and 5000types/month.


Q3:If we have no PCB file/Gerber file, only have the PCB sample,can you produce it for me?
A: Yes,we could help you to clone the PCB. Just send the sample PCB to us, we could clone the PCB design and work out it.


Q4:How will you usually ship the PCB?
A: Usually for small packages, we will ship the boards by DHL,UPS,FedEx door to door service, we could use your shipping account to do collection or use our account to ship in DDU (import duty unpaid) delivery term.
For heavy goods more than 300kg, we may ship your PCB boards by ship or by air to save freight cost. Of course, if you have your own forwarder, we may contact them for dealing with your shipment.


Q5:What is your standard lead time for production?
A: Sample/prototype(less than 3sqm):
1-2 Layers: 3 to 5working days (fastest 24hours for quick turn services)
4-8 Layers: 7~12 working days (fastest 48hours for quick turn services)
Mass production (less than 200sqm):
1-2 Layers:7 to 12 working days
4-8 Layers:10 to 15 working days


China 12mil FR4 Flex Electronic Circuit Boards 4 Layer HDI High Frequency supplier

12mil FR4 Flex Electronic Circuit Boards 4 Layer HDI High Frequency

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