FR4 TG170 Multilayer Printed Circuit Board

FR4 TG170 Multilayer Printed Circuit Board

Multilayer Printed Circuit Board Copper Filled Printed Circuit Board Gold Finger Supplied Stack-Up 12L PCB

12L Multilayer Rigid Printed Circuit Board

Board type: Multilayer Printed Circuit board(12L)

Surface finished: Immersion gold 2u" (0.05 - 0.1 µm gold over 3 - 5 µm of Nickel.) and gold finger

Finished PCB thickness (mm): 2.2mm, +/-10%

Specific raw material requirements: FR4, TG170

Copper weight of outer layer: 1 oz (35µm) Finished Copper Weight

Copper weigh of inner layer: 1/2 oz (18µm) Base Weight

Plating thickness of through hole: 25 microns

Impedance control: Yes

Countersink hole/ coutersunk hole:No

Counterbore hole: No

Smallest hole is 0.2mm

PTH hole tolerance: +/-0.075mm

Solder Resist: 2 Sides, blue

Silkscreen: 2 Sides, white

Circuit profile: V-CUT and routed

E-test request: all PCBs be e-tested

IPC class: 3

Special requirements: Copper filled vias and supplied stack-up

Founded in 2010, Shenzhen Huashengxin Circuit is a professional manufacturer for printed circuit boards. HSX Circuit provides flexible quick turn production services (12hours to 72 hours), as well as small volume to big volume PCB manufacturing. Its products covers 1~32L FR-4 PCB, IMS PCB, HDI Boards, high frequency PTFE boards and Rigid-flex boards etc.

Under the support of high-educated and experienced team and advanced production equipment, HSX Circuit has won great reputation from the global markets because of its professional services and high quality products.

HSX Circuit covers a total production area of 10,000 square meters, employs more than 350 workers, produces over 5,000 PCB types monthly. Its products are widely used in high-tech fields such as communications, power supplies, computer networks, digital products, industrial control, science and education, medical devices, and aerospace.