Product Details
45℃ Thermal Management PCM Safety Protection Flagship: The Key To
The Stable Operation Of Electronic Devices
Tips--How to choose phase change materials:
- Thermophysical properties factor
- Physical factors
- Dynamic factor
- Chemical factors
- Economic factors
Summary:
Phase change materials (PCMs) are ideal for thermal management
solutions. This is because they store and release thermal energy as
they melt and freeze (transition from one stage to another). When
this material freezes, it releases a significant amount of energy,
in the form of fusion latent heat or crystallization energy.
Instead, when a substance melts, it absorbs the same amount of
energy from its surroundings as it changes from a solid to a
liquid.
How it works:
- When the temperature is below 45 ° C, the 45 ° C thermal management
phase change material is in a solid state.
- At this time, the molecular structure or crystal structure of the
material is relatively stable, the intermolecular interaction force
is strong, and the internal energy of the material is low. As the
temperature gradually increases, when the phase transition
temperature point of 45℃ is reached, the material begins to undergo
phase transition.
- In the process of phase transition, the molecular structure or
crystal structure of the material will be changed, the interaction
between molecules will be weakened, and the material will be
transformed from a solid to a liquid state. This process needs to
absorb a lot of heat, which effectively reduces the temperature of
the surrounding environment, and plays the role of heat absorption
and cooling.
- On the contrary, when the temperature drops from a state higher
than 45 ° C, the material will gradually return from liquid to
solid, and at the same time release the heat absorbed before,
playing the role of heat release and heating. This process of heat
absorption and release is reversible and can be repeated.
Application of phase change materials - Heat dissipation of
electronic devices:
1. Heat dissipation of the chip
- With the continuous improvement of the performance of electronic
equipment, the heating power of the chip is getting higher and
higher.
- 45℃ thermal management Phase change materials can be attached to
the surface of the chip, when the chip temperature rises to 45℃,
the phase change material phase change, from solid to liquid,
absorb a lot of heat, so as to effectively reduce the temperature
of the chip, protect the chip from overheating damage, extend its
service life.
- For example, it is widely used in the heat dissipation of
high-power CPU, GPU and other chips.
2. Heat dissipation of the circuit board
- The electronic components on the circuit board will generate heat
when working, and the long-term high temperature environment will
affect the performance and reliability of the circuit board.
- The application of 45℃ thermal management phase change material to
the circuit board can absorb heat when the component is heated,
maintain the temperature stability of the circuit board, and reduce
the circuit failure caused by excessive temperature.