Name: M29W640GT70ZA6EP MICRON NOR Flash Parallel 3V/3.3V 64M-bit 8M x 8/4M x 16 70ns 48-Pin TFBGA Tray
Brand: MICRON
Price: 1 USD

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M29W640GT70ZA6EP MICRON NOR Flash Parallel 3V/3.3V 64M-bit 8M x 8/4M x 16 70ns 48-Pin TFBGA Tray

Brand Name:MICRON

Model Number:M29W640GT70ZA6EP

Minimum Order Quantity:100

Delivery Time:7-15 days

Payment Terms:paypal, T/T

Place of Origin:CHIAN

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Sunbeam Electronics (Hong Kong) Limited

Active Member

Location: Shenzhen China

Address: Internatinal Logistics Center A-702, No. 1 South China Road, ShenZhen, China

Supplier`s last login times: within 2 hours

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Product Details Company Profile

Product Details

Product Technical Specifications

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

Part Status

Obsolete

Automotive

PPAP

Cell Type

NOR

Chip Density (bit)

64M

Architecture

Sectored

Boot Block

Yes

Block Organization

Asymmetrical

Location of Boot Block

Top

Address Bus Width (bit)

23/22

Sector Size

64Kbyte x 127|8Kbyte x 8

Page Size

4Words

Number of Bits/Word (bit)

8/16

Number of Words

8M/4M

Programmability

Yes

Timing Type

Asynchronous

Max. Access Time (ns)

Maximum Erase Time (S)

400/Chip

Maximum Page Access Time (ns)

Maximum Programming Time (ms)

400000/Chip

OE Access Time (ns)

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3.3|3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

11.5 to 12.5|2.7 to 3.6

Operating Current (mA)

Program Current (mA)

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

Supplier Temperature Grade

Industrial

Command Compatible

ECC Support

Support of Page Mode

Yes

Minimum Endurance (Cycles)

100000

Packaging

Tray

Supplier Package

TFBGA

Pin Count

Standard Package Name

BGA

Mounting

Surface Mount

Package Height

0.9(Max)

Package Length

Package Width

PCB changed

Lead Shape

Ball

M29W640GT70ZA6EP MICRON NOR Flash Parallel 3V/3.3V 64M-bit 8M x 8/4M x 16 70ns 48-Pin TFBGA Tray

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