2835 3v SMD LED Chip 300ma 140-160lm CCT 9000k For Backlight
Brand Name:PHOENIX
Certification:LM80 CE ROHS
Model Number:2835
Minimum Order Quantity:4000PCS
Delivery Time:7-10 DAYS
Payment Terms:Western Union, MoneyGram, T/T
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Site Member
Location:
Suzhou Jiangsu China
Address:
Bld#20,NO 88 Lingshan road ,wuzhong district,suzhou, jiangsu ,China
Supplier`s last login times:
within 26 hours
Product Details
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Product Details
Application Introduction:
The bulb uses LED as the light source, and the LED works without IR (infrared) and UV (ultraviolet) radiation at all. Moreover, the LED light source used in this product does not have any filling gas, and there is no crushing damage, which will not have an adverse impact on the environment. Thus, it reflects its environmental protection side
2835 3v SMD LED chip 300ma 140-160lm cct 9000k for backlight
Quick details:
| Input Voltage(V): | 3V |
| Warranty(Year): | 2-Year |
| Type: | Smd Led Chip 2835 |
| Lighting solutions service: | Lighting and circuitry design |
| Luminous Efficacy(lm/w): | 160lm/w |
| Lifespan (hours): | 50000 |
| Working Time (hours): | 20000 |
| Chip Material: | INGAN |
| Emitting Color: | 9000-30000k |
| Power: | 1w |
| Viewing Angle(°): | 120 Degree |
| Color Rendering Index(Ra): | 80 |
| Packing bag: | 220*240nm |
| Place of Origin: | Suzhou ,jiangsu |
| Application: | LED STRIP |
| Package Type: | Suface Mount Package |
| Forward Current: | 300MA |
| Size: | 2.8*3.5*0.65mm |
| Packing: | 4000 Pcs/Roll |
Product specification:
Package Structure
Absolute Maximum Ratings
| Item | Symbol | Absolute Maximum Ratings | Unit |
| Forward Current | IF | 350 | mA |
| Reverse Voltage | Vr | 5 | V |
| Pulsed Forward Current | IFP* | 400 | mA |
| Power dissipation | PD | 1.5 | W |
| Operating Temperature | TOP | -40~85 | ℃ |
| Storage Temperature | TST | -40~85 | ℃ |
| Electrostatic Discharge | ESD | 2000(HBM) | V |
| Junction Temperature | Tj | 120 | ℃ |
| LED Thermal resistance | Rth s-j | 30 | ℃/W |
Typical Electro-Optical characteristics curves:
LED Reliability Test List
| Test Item | Test Conditions | Standard | Qty(Pcs) | Ac/Re |
| Life Test | 25℃,1000Hrs@350mA | / | 22 | 0/1 |
| High Temperature | 85℃,1000Hrs@350mA | / | 22 | 0/1 |
| Low Temperature | -40℃,1000Hrs@350mA | / | 22 | 0/1 |
| High Humidity Heat | 85℃,85%RH, 1000Hrs@350mA | / | 22 | 0/1 |
| Low Temperature Storage | -40℃,1000Hrs | JEITA ED-4701 200 202 | 22 | 0/1 |
| High Temperature Storage | 100℃,1000Hrs | JEITA ED-4701 200 201 | 22 | 0/1 |
| Temperature Cycle | (-40'C 30mins --25'C(5mins)--100'C(30mins) ,Temp changing rate:3+/-0.6'C/min) | JEITA ED-4701 100 105 | 22 | 0/1 |
| Thermal Shock | -40'C(15mins) --100'C(15mins),changing time <5mins ,300C | MIL-STD-202G | 22 | 0/1 |
Pulse Life Test | Tp=1ms,DC=0.1,D=Tp/T @ 3×350mA | / | 22 | 0/1 |
| ESD Test(HBM) | 2000V,200V/Step, Forward & Reverse Test both 3times | AEC (Q101-001) | 22 | 0/1 |
| Soldering Resistance | 260±5℃,10S,3times Pre-treatment 30℃,70%RH | JEITA ED-4701 300 302 | 22 | 0/1 |
| Reflow IV Decay | 260±5℃,10S,1time Pre-treatment 30℃,70%RH,168Hrs | / | 22 | 0/1 |
| Judgment Criteria | ||||
| Forward Voltage VF | VF Max-Increase < 1.1x | |||
| Reverse Current IR | IR Max-Increase < IRmax | |||
| Luminous Intensity IV | IV Decay < 30% | |||
※Solder ability test criteria:coverage is not less than 95% Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours) | ||||
Packaging:
Cautions:
The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.
Soldering iron :
When hand soldering, the temperature of the iron must less than
300℃ for 3 seconds
The hand solder should be done only one times
SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following
Handling Precautions :
Handle the component along the side surface by using forceps or
appropriate tools
Do not directly touch or handle the silicone lens surface. It may
damage the internal circuitry
Do not stack together assembled PCBs containing LEDs. Impact may
scratch the silicone lens or damage the internal circuitry
Product features:
Adopt good quality chip and frame ,antistatic good stability Ultra low attenuation
High brightness ,low attenuation high color rendering
Minimum 70,80,90 95 CRI options
Strong welding and good stability undead light
Product series and company logo on the front
CE ROHS LM80 Certification
Production Process:
2835 3v SMD LED Chip 300ma 140-160lm CCT 9000k For Backlight
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