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Red Solder Mask FR4 Circuit Board 1 OZ Copper Thickness OSP Treatment

Red Solder Mask FR4 Circuit Board 1 OZ Copper Thickness OSP Treatment

Brand Name:WITGAIN PCB
Certification:UL
Model Number:Multi-Layer PCB000352
Minimum Order Quantity:1 pcs/lot
Delivery Time:20 days
Payment Terms:T/T
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Location: Shenzhen China
Address: Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111
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Red Solder Mask FR4 Substrate Material 1 OZ Copper Thickness OSP Treatment


PCB Specifications:


1 Part NO: Multi-Layer PCB000351

2 Layer Count: 8 Layer PCB

3 Finished Board Thickness: 1.6MM

4 Copper Thickness: 1/1/1/1/1/1 OZ

5 Min Lind Space&Width: 3.5/3.5 mil

6 Application Area: Amplifier



Material Data Sheet:


S1000-2
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC180
IPC-TM-650 2.4.24.4DMA185
TdIPC-TM-650 2.4.24.65% wt. loss345
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃45
After Tgppm/℃220
50-260℃%2.8
T260IPC-TM-650 2.4.24.1TMAmin60
T288IPC-TM-650 2.4.24.1TMAmin20
T300IPC-TM-650 2.4.24.1TMAmin5
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--100S No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm2.2 x 108
E-24/125MΩ.cm4.5 x 106
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance7.9 x 107
E-24/1251.7 x 106
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s100
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV63
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.8
IEC 61189-2-72110GHz--
Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.013
IEC 61189-2-72110GHz--
Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.38
125℃N/mm1.07
Flexural StrengthLWIPC-TM-650 2.4.4AMPa562
CWIPC-TM-650 2.4.4AMPa518
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.1
CTIIEC60112ARatingPLC 3
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0

FAQ:


Q1: What are PCB Mouse bites?

A1:

Mouse bites also known as perforated breakaway tabs in a PCB are small perforations / pricks on the board which allow for panelizing and depanelizing smaller groups of PCBs together. This way multiple PCB boards can be assembled together, thereby saving time and making the process cost-effective. The assembled PCBs can be separated by applying pressure on the sections of the board that have perforations. Once separated, i.e after the depanelization process, the board looks like it has mouse bites in these sections.

Below is an Image of PCBs assembled to each other with the help of mouse bites.

Below is an Image of a PCB being depaneled easily which is also made possible due to mouse bites. You can also see the sharp edges after the boards have been separated, these are called mouse bites.

When multiple PCBs are connected using mouse bites they have a smooth finish. When compared to PCB boards connected using V-Scoring, boards connected with mouse bites are easier to depanelize i.e they require less force.

Precautions to take before inserting Mouse bites on a PCB

  • Develop an adequate number of mouse bites to support a board completely when paneled with other boards
  • Do not place the mouse bites close to sensitive component areas or circuitry. This will cause the board to experience breakout stress which can damage sensitive components or sections of the board
  • The spacing between two mouse bites must range between 60mm to 90mm

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Red Solder Mask FR4 Circuit Board 1 OZ Copper Thickness OSP Treatment

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