HDI Blind Buried Half Hole PCB 8 Layer OSP Immersion Gold
Brand Name:WITGAIN PCB
Certification:UL
Model Number:Half hole PCB0016
Minimum Order Quantity:1 pcs/lot
Delivery Time:20 days
Payment Terms:T/T
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Shenzhen China
Address:
Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111
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8 Layer HDI PCB Half Hole Blind And Buried Holes OSP+Immersion Gold
Board Info:
1 Part NO: Half hole PCB0016
2 Layer Count: 8 Layer PCB
3 Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM
4 Solder Mask: Green
5 Min Lind Space&Width: 3/3 mil
6 Application Area: GPS Module
7 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L3-L6 0.15MM, L6-L7 0.1MM, L7-L8 0.1MM, L1-L2 0.2MM Blind and Buried Holes
Our Capabilities:
| NO | Item | Capability |
| 1 | Layer Count | 1-24 Layers |
| 2 | Board Thickness | 0.1mm-6.0mm |
| 3 | Finished Board Max Size | 700mm*800mm |
| 4 | Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) |
| 5 | Warp | <0.7% |
| 6 | Major CCL Brand | KB/NanYa/ITEQ/ShengYi/Rogers Etc |
| 7 | Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET |
| 8 | Drill Hole Diameter | 0.1mm-6.5mm |
| 9 | Out Layer Copper Thickness | 1/2OZ-8OZ |
| 10 | Inner Layer Copper Thickness | 1/3OZ-6OZ |
| 11 | Aspect Ratio | 10:1 |
| 12 | PTH Hole Tolerance | +/-3mil |
| 13 | NPTH Hole Tolerance | +/-1mil |
| 14 | Copper Thickness of PTH Wall | >10mil(25um) |
| 15 | Line Width And Space | 2/2mil |
| 16 | Min Solder Mask Bridge | 2.5mil |
| 17 | Solder Mask Alignment Tolerance | +/-2mil |
| 18 | Dimension Tolerance | +/-4mil |
| 19 | Max Gold Thickness | 200u'(0.2mil) |
| 20 | Thermal Shock | 288℃, 10s, 3 times |
| 21 | Impedance Control | +/-10% |
| 22 | Test Capability | PAD Size min 0.1mm |
| 23 | Min BGA | 7mil |
| 24 | Surface Treatment | OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc |
IT180A Data Sheet:
| Items | IPC TM-650 | Typical Value | Unit |
| Peel Strength, minimum A. Low profile copper foil B. Standard profile copper foil | 2.4.8 | 5 8 | lb/inch |
| Volume Resistivity | 2.5.17.1 | 1x109 | M-cm |
| Surface Resistivity | 2.5.17.1 | 1x108 | M |
| Moisture Absorption, maximum | 2.6.2.1 | 0.10 | % |
| Permittivity (Dk, 50% resin content) A. 1MHz B. 1GHz | 2.5.5.9 2.5.5.9 | 4.5 4.4 | -- |
| Loss Tangent (Df, 50% resin content) A. 1MHz B. 1GHz | 2.5.5.9 2.5.5.9 | 0.014 0.015 | -- |
| Flexural Strength, minimum A. Length direction B. Cross direction | 2.4.4 | 500-530 410-440 | N/mm2 |
| Thermal Stress 10 s at 288°C A. Unetched B. Etched | 2.4.13.1 | Pass Pass | Rating |
| Flammability | UL94 | V-0 | Rating |
| Comparative Tracking Index (CTI) | IEC 60112 / UL 746 | CTI 3 (175-249) | Class (Volts) |
| Glass Transition Temperature(DSC) | 2.4.25 | 175 | ˚C |
| Decomposition Temperature | 2.4.24.6 | 345 | ˚C |
| X/Y Axis CTE (40℃ to 125℃) | 2.4.41 | 11-13 / 13-15 | ppm/˚C |
| Z-Axis CTE A. Alpha 1 B. Alpha 2 C. 50 to 260 Degrees C | 2.4.24 | 45 210 2.7 | ppm/˚C ppm/˚C % |
| Thermal Resistance A. T260 B. T288 | 2.4.24.1 | >60 20 | Minutes Minutes |
HDI Blind Buried Half Hole PCB 8 Layer OSP Immersion Gold
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