KB6165 Material Half Hole PCB Circuit Card Assemblies 4 Layer 1.0 MM

Brand Name:WITGAIN PCB
Certification:UL
Model Number:Half hole PCB0015
Minimum Order Quantity:1 pcs/lot
Delivery Time:20 days
Payment Terms:T/T
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Location: Shenzhen China
Address: Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111
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Product Details

4 Layer Half Hole PCB KB6165 Material 1.0 MM Thickness


Board Info:


1 Part NO: Half hole PCB0015


2 Layer Count: 4 Layer PCB


3 Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM


4 Solder Mask: Black


5 Min Lind Space&Width: 4/4 mil


6 Application Area: Blue-tooth Module


7 Drillings: L1-L4 0.2MM Mechanical Drilling


8 PCB Size: 100mm*60mm/21pcs


Packing Specifications:


1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.


X-OUT per panel:


1 X-OUT panel must be packed separately and marked clearly

2 A black X must be permanently marked on both sides of pcb

3 X-OUT per panel not be over 25%

4 X-OUT per lot not be over 5%



Our Capabilities:


NOItemCapability
1Layer Count1-24 Layers
2Board Thickness0.1mm-6.0mm
3Finished Board Max Size700mm*800mm
4Finished Board Thickness Tolerance+/-10% +/-0.1(<1.0mm)
5Warp<0.7%
6Major CCL BrandKB/NanYa/ITEQ/ShengYi/Rogers Etc
7Material TypeFR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
8Drill Hole Diameter0.1mm-6.5mm
9Out Layer Copper Thickness1/2OZ-8OZ
10Inner Layer Copper Thickness1/3OZ-6OZ
11Aspect Ratio10:1
12PTH Hole Tolerance+/-3mil
13NPTH Hole Tolerance+/-1mil
14Copper Thickness of PTH Wall>10mil(25um)
15Line Width And Space2/2mil
16Min Solder Mask Bridge2.5mil
17Solder Mask Alignment Tolerance+/-2mil
18Dimension Tolerance+/-4mil
19Max Gold Thickness200u'(0.2mil)
20Thermal Shock288℃, 10s, 3 times
21Impedance Control+/-10%
22Test CapabilityPAD Size min 0.1mm
23Min BGA7mil
24Surface TreatmentOSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc
China KB6165 Material Half Hole PCB Circuit Card Assemblies 4 Layer 1.0 MM supplier

KB6165 Material Half Hole PCB Circuit Card Assemblies 4 Layer 1.0 MM

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