4 Layer HDI PCB Blind Buried Holes 1.6 MM Thickness TG 150 Material

Brand Name:WITGAIN PCB
Certification:UL
Model Number:HDIPCB0013
Minimum Order Quantity:1pcs/lot
Delivery Time:25 days
Payment Terms:T/T
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Location: Shenzhen China
Address: Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111
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Product Details

HDI PCB 4 Layer Blind And Buried Holes 1.6 MM Thickness TG 150 Material


PCB Specifications:


1 Part NO: HDIPCB0013

2 Layer Count: 4 Layer HDI PCB

3 Finished Board Thickness: 1.6MM

4 Drilling: L1-L2 0.15MM, L1-L4 0.2MM

5 Min Lind Space&Width: 6/6mil

6 Copper Thickness: 1/1/1/1 OZ

7 Application Area: Consumer Products

8 File Format: Gerber File

9 PCB Size: 110mm*100mm/6pcs

10 Other Requirements: 0.2MM Holes on BGA PAD, Need to do epoxy filled in vias


Our production applications:


1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.


IT180A Data Sheet:


ItemsIPC TM-650Typical ValueUnit
Peel Strength, minimum
A. Low profile copper foil
B. Standard profile copper foil
2.4.85
8
lb/inch
Volume Resistivity2.5.17.11x109M-cm
Surface Resistivity2.5.17.11x108M
Moisture Absorption, maximum2.6.2.10.10%
Permittivity (Dk, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
4.5
4.4
--
Loss Tangent (Df, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
0.014
0.015
--
Flexural Strength, minimum
A. Length direction
B. Cross direction
2.4.4500-530
410-440
N/mm2
Thermal Stress 10 s at 288°C
A. Unetched
B. Etched
2.4.13.1Pass PassRating
FlammabilityUL94V-0Rating
Comparative Tracking Index (CTI)IEC 60112 / UL 746CTI 3 (175-249)Class (Volts)
Glass Transition Temperature(DSC)2.4.25175˚C
Decomposition Temperature2.4.24.6345˚C
X/Y Axis CTE (40℃ to 125℃)2.4.4111-13 / 13-15ppm/˚C
Z-Axis CTE
A. Alpha 1
B. Alpha 2
C. 50 to 260 Degrees C
2.4.2445
210
2.7
ppm/˚C ppm/˚C
%
Thermal Resistance
A. T260
B. T288
2.4.24.1>60
20
Minutes Minutes

China 4 Layer HDI PCB Blind Buried Holes 1.6 MM Thickness TG 150 Material supplier

4 Layer HDI PCB Blind Buried Holes 1.6 MM Thickness TG 150 Material

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