Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material

Brand Name:WITGAIN PCB
Certification:UL
Model Number:HDIPCB0005
Minimum Order Quantity:1pcs/lot
Delivery Time:15-20 days
Payment Terms:T/T
Contact Now

Add to Cart

Active Member
Location: Shenzhen China
Address: Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

8 Layer HDI PCB FR4 Material Blind And Buried Holes High TG170


  • Main Features:

1 8 Layer HDI PCB with blind and buried holes.

2 Green solder mask and immersion gold treatment.

3 Min hole size is 0.1mm and min BGA size is 9mil.

4 Finished board thickness is 0.8mm.

5 The production cost will be higher than normal multilayer pcb and lead time will also be longer.

6 Need 3 round laminations and 4 round drillings.

7 2+N+2 hole structure: L1-L2 L2-L3 L1-L3 L7-L8 L6-L7 L6-L8 0.1MM, L3-L6 0.2MM, L1-L8 0.2MM.

8 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated.


  • Our Product Categories:

Our Product Categories
Material KindsLayer CountsTreatments
FR4Single LayerHASL Lead Free
CEM-12 Layer/Double LayerOSP
CEM-34 LayerImmersion Gold/ENIG
Aluminum Substrate6 LayerHard Gold Plating
Iron Substrate8 LayerImmersion Silver
PTFE10 LayerImmersion Tin
PI Polymide12 LayerGold fingers
AL2O3 Ceramic Substrate14 LayerHeavy copper up to 8OZ
Rogers, Isola high frequency materials16 LayerHalf plating holes
Halogen free18 LayerHDI Laser drilling
Copper based20 LayerSelective immersion gold
22 Layerimmersion gold +OSP
24 LayerResin filled in vias

  • FAQ:

Q1: What is Surface Mount PCB Assembly?

A1: Surface mount in a PCB assembly means that each component on the PCB is mounted on the surface of the board. In the PCB Assembly process for surface mount components, solder paste is placed on the PCB board at areas where surface mount components will be placed on the board. PCB Stencils are usually used to apply solder paste on the PCB board and a pick and place machine is used to place SMT components on the board.

Surface Mount Assembly is very cost effective, takes up less board space and requires short production times as compared to thru-hole assembly, as it does not require the drilling of holes through the board. However, the component grip is not as good as thru-hole and also the connection can be faulty if not soldered properly.


China Blind Buried Holes Rapid Prototyping PCB  8 Layer HDI High TG170 FR4 Material supplier

Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material

Inquiry Cart 0