PS2 PS3 Mobile IC Removal Machine 0.8mm-8mm Laptop Motherboard Repair Reballing
Brand Name:Wisdomshow optical alignment bga rework station
Certification:ce
Place of Origin:Guangdong, China
Packaging Details:wooden box iphone ic remove machine
Supply Ability:800 Piece/Pieces per Month iphone ic remove machine
Price:$12,960.00/Pieces >=1 Pieces
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Location:
Shenzhen Guangdong China
Address:
Building 7, No. 6, West Industrial Zone, Hosi, Xihuan Road, Shajing Street, Baoan District, Shenzhen, Guangdong
Supplier`s last login times:
within 38 hours
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Product Details
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Product Details
WDS-750 optical alignment iphone ic remove machine for XBOX PS2 PS3 Wii X360 laptop motherboard repair reballing
Details Picture optical alignment iphone ic remove machine:
- Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.BGA repair machine IR6000 optical alignment bga rework station iphone icloud remove machine
- PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate bga station for iphone
- Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode[preheating,constant,warming,soldering,reflow soldering,cooling]
- Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction mode [weld,remove,mount,manual],realize semi auto and auto function ,meet customer’s requirement
- High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1℃
- Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
- Top heater and mounting heater design2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
- High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result. pcb soldering machine iphone
- Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function) BGA repair machine IR6000
Specifications of WDS-750 BGA Chips Reballing Machine optical
alignment iphone ic remove machine
| power | 6800W |
| Up heater power | 1200W |
| Down heater power | 1200W |
| IR heater power | 4200W(2400W control) |
| Power supply | (Single Phase) AC 220V±10 50Hz |
| Position way | Optical lens+ Vshape holder+laser positioning |
| Temperature control | High precision K shape sensor(Closed Loop),up and down,independent,temperature,heating zone,Precision can reach±1℃ |
| Material | High sensitive touch screen+temperature control module+PLC+step drive |
| PCB Size | Max:500×450mm , Min: 10×10mm |
| Thermo-couple Ports | 4pcs |
| Chips magnification times | 2-30 |
| PCB thickness | 0.5-8mm |
| BGA size | 0.8mm-8cm |
| Min.chips pitch | 0.15mm |
| Mounting BGA weight | 1000G |
| Mounting precision | ±0.01mm |
| Size | L670×W780×H850mm |
| Optical alignment lens | Motor drive can move front back right left |
| Weight | About 90kg |
Company certificates
Our BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop,
mobile phone, xbox360,ps3,etc.
The main user is repairing shops and factory to provide the after-sales service and rework.
How to separate BGA chip from motherboard?
How to replace a new BGA chip?
Repair steps:
1) Separate the BGA chip from mother board –we called desoldering
2) Clean Pad
3) Reballing or replace a new BGA chip directly
4) Alignment/Positioning – Depend on experience ,silk frame ,optical camera
5) replace a new BGA chip - we called Soldering
The main user is repairing shops and factory to provide the after-sales service and rework.
How to separate BGA chip from motherboard?
How to replace a new BGA chip?
Repair steps:
1) Separate the BGA chip from mother board –we called desoldering
2) Clean Pad
3) Reballing or replace a new BGA chip directly
4) Alignment/Positioning – Depend on experience ,silk frame ,optical camera
5) replace a new BGA chip - we called Soldering
Why WDS?
1. We are the Manufactuer = own factory+ machine design+Sheet metal produced by ourself +spray the powder+ strong assemble the machine team + packaging+free training;
2. Logo/Brand:Customer's designs and logos are welcome,we can silk-print your own logo company;
3. HUAWEI,TCL,ZTE,MEIZU,KONKA,LENOVO,FOXCONN vendor;
4. Have good market in Korea,Japan,NorthAfrica,Vietnam,Brazil,Turkey,India,Mexico and South Asia,The Mid-East and European countries;
5. 100% NEW from WDS factory;
6. Over 20 R&D engineers, with 10 year experience;
7. Over 100000 Global User;
8. All models approved CE ISO9001;
9. 100% QC inspect before shipment;
10. High quality & competitive price.
PS2 PS3 Mobile IC Removal Machine 0.8mm-8mm Laptop Motherboard Repair Reballing
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