Multiscene Laptop CPU Thermal Pad
Brand Name:AOK
Certification:RoHS, Reach, UL
Model Number:UTP100
Minimum Order Quantity:1000pcs
Delivery Time:13-15working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
302 GuihuaRoad, GuixiangVillage, GuanlanTown, LonghuaDistrict, Shenzhen City,Guangdong Province, P.R China
Supplier`s last login times:
within 28 hours
Product Details
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Product Details
Ultra Soft Thermal Pad Ultra Soft Custom Silicon Thermal Pad For Heat Dissipation
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler, Silicone, and Reinforced Fiberglass | - |
| Color | White and Brick Red | Visual |
| Thickness(mm) | 0.5~12.0 | ASTM D374 |
| Density(g/cc) | 2.5 | ASTM D792 |
| Hardness(shore oo) | 30±5 | ASTM D2240 |
| Tensile Strength(KN/m) | 2.5 | ASTM D624 |
| Elongation(%) | 60 | ASTM D412 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥7.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 5.7 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1.0*1013 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 1.0±0.1 | ASTM D5470 |
Product feature:
■ Thermal Conductivity:1.0 W/m.K
■ Ultra soft and highly compliant
■ Naturally tacky on one side
■ because the air is a bad conductor of heat, it will seriously
hinder the transfer of heat between the contact surface, and the
thermal silicone sheet can be installed between the heat source and
the radiator to squeeze the air out of the contact surface;
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ the material is soft, good compression performance, good thermal
insulation performance, adjustable thickness range is relatively
large, suitable for filling the cavity, both sides have natural
viscosity, operability and maintainability;
Typical applications:
■ Networking and Telecommunications
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ Consumer Electronics: Gaming Systems, and LCDs
Purchase information:
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
Multiscene Laptop CPU Thermal Pad
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