Semi-Insulating , Epi-Ready Gallium Arsenide Substrate, 6”, Prime Grade

Brand Name:PAM-XIAMEN
Minimum Order Quantity:1-10,000pcs
Delivery Time:5-50 working days
Payment Terms:T/T
Place of Origin:China
Supply Ability:10,000 wafers/month
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Location: Xiamen Fujian China
Address: #506B, Henghui Business Center, No.77, Lingxia Nan Road, High Technology Zone, Huli, Xiamen 361006, China
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Semi-Insulating , Epi-Ready Gallium Arsenide Substrate, 6”, Prime Grade


PAM-XIAMEN provides both single crystal and polycrystalline GaAs wafer ( Gallium Arsenide ) for opto-electronics and micro-electronics industry for making LD , LED , microwave circuit and solar cell applications , the wafers is in diameter range from 2" to 6" in various thicknesses and orientations. We offer single crystal GaAs wafer produced by two main growth techniques LEC and VGF method , allowing us to provide customers the widest choice of GaAs material with high uniformity of electrical properties and excellent surface quality . Gallium Arsenide can be supplied as ingots and polished wafer, both conducting and semi-insulating GaAs wafer , mechanical grade and epi ready grade are all available . We can offer GaAs wafer with low EPD value and high surface quality suitable for your MOCVD and MBE applications. PAM-XIAMEN can produce wide range grades: prime grade, test grade, and optical grade. Please contact our engineer team for more wafer information.


(6″ (150mm)(GaAs)Gallium Arsenide Wafers,Semi-insulating for Microelectronics Applications

ItemSpecificationsRemarks
Conduction Type

Semi-insulating

Growth MethodVGF
DopantUndoped
TypeN
Diamater(mm)150±0.25
Orientation

(100)0°±3.0°

NOTCH Orientation〔010〕±2°
NOTCH Deepth(mm)(1-1.25)mm 89°-95°
Carrier Concentration

N/A

Resistivity(ohm.cm>1.0×107 or 0.8-9 x10-3
Mobility(cm2/v.s)N/A
Dislocation

N/A

Thickness(µm)

675±25

Edge Exclusion for Bow and Warp(mm)N/A
Bow(µm)N/A
Warp(µm)

≤20.0

TTV(µm)≤10.0
TIR(µm)≤10.0
LFPD(µm)

N/A

PolishingP/P Epi-Ready

Properties of GaAs Crystal

PropertiesGaAs
Atoms/cm34.42 x 1022
Atomic Weight144.63
Breakdown Fieldapprox. 4 x 105
Crystal StructureZincblende
Density (g/cm3)5.32
Dielectric Constant13.1
Effective Density of States in the Conduction Band, Nc (cm-3)4.7 x 1017
Effective Density of States in the Valence Band, Nv (cm-3)7.0 x 1018
Electron Affinity (V)4.07
Energy Gap at 300K (eV)1.424
Intrinsic Carrier Concentration (cm-3)1.79 x 106
Intrinsic Debye Length (microns)2250
Intrinsic Resistivity (ohm-cm)108
Lattice Constant (angstroms)5.6533
Linear Coefficient of Thermal Expansion,6.86 x 10-6
ΔL/L/ΔT (1/deg C)
Melting Point (deg C)1238
Minority Carrier Lifetime (s)approx. 10-8
Mobility (Drift)8500
(cm2/V-s)
µn, electrons
Mobility (Drift)400
(cm2/V-s)
µp, holes
Optical Phonon Energy (eV)0.035
Phonon Mean Free Path (angstroms)58
Specific Heat0.35
(J/g-deg C)
Thermal Conductivity at 300 K0.46
(W/cm-degC)
Thermal Diffusivity (cm2/sec)0.24
Vapor Pressure (Pa)100 at 1050 deg C;
1 at 900 deg C

WavelengthIndex
(µm)
2.63.3239
2.83.3204
33.3169
3.23.3149
3.43.3129
3.63.3109
3.83.3089
43.3069
4.23.3057
4.43.3045
4.63.3034
4.83.3022
53.301
5.23.3001
5.43.2991
5.63.2982
5.83.2972
63.2963
6.23.2955
6.43.2947
6.63.2939
6.83.2931
73.2923
7.23.2914
7.43.2905
7.63.2896
7.83.2887
83.2878
8.23.2868
8.43.2859
8.63.2849
8.83.284
93.283
9.23.2818
9.43.2806
9.63.2794
9.83.2782
103.277
10.23.2761
10.43.2752
10.63.2743
10.83.2734
113.2725
11.23.2713
11.43.2701
11.63.269
11.83.2678
123.2666
12.23.2651
12.43.2635
12.63.262
12.83.2604
133.2589
13.23.2573
13.43.2557
13.63.2541

What is the GaAs Process?

GaAs wafers must be prepared prior to device fabrication. To start, they must be completely cleaned to remove any damage that might have occurred during the slicing process. The wafers are then Chemically Mechanically Polished/Plaranrized (CMP) for the final material removal stage. This allows for the attainment of super-flat mirror-like surfaces with a remaining roughness on an atomic scale. After that is completed, the wafer is ready for fabrication.


What is the Thermal properties of GaAs Wafer?

Bulk modulus7.53·1011 dyn cm-2
Melting point1240 °C
Specific heat0.33 J g-1°C -1
Thermal conductivity0.55 W cm-1 °C -1
Thermal diffusivity0.31cm2s-1
Thermal expansion, linear5.73·10-6 °C -1

Temperature dependence of thermal conductivity
n-type sample, no (cm-3): 1. 1016; 2. 1.4·1016; 3. 1018;
p-type sample, po (cm-3): 4. 3·1018; 5. 1.2·1019.
Temperature dependence of thermal conductivity (for high temperature)
n-type sample, no (cm-3): 1. 7·1015; 2. 5·1016; 3. 4·1017; 4. 8·1018;
p-type sample, po (cm-3): 5. 6·1019.
Temperature dependence of specific heat at constant pressure Ccl= 3kbN = 0.345 J g-1°C -1.
N is the number of atoms in 1 g og GaAs.
Dashed line: Cp= (4π2Ccl / 5θo3)·T3 for θo= 345 K.
Temperature dependence of linear expansion coefficient α

Melting pointTm=1513 K
For 0 < P < 45 kbarTm= 1513 - 3.5P (P in kbar)
Saturated vapor pressure(in Pascals)
1173 K1
1323 K100

Are You Looking for GaAs Wafer?

PAM-XIAMEN is your go-to place for everything wafers, including GaAs wafers, as we have been doing it for almost 30 years! Enquire us today to learn more about the wafers that we offer and how we can help you with your next project. Our group team is looking forward to providing both quality products and excellent service for you!

China Semi-Insulating , Epi-Ready Gallium Arsenide Substrate, 6”, Prime Grade supplier

Semi-Insulating , Epi-Ready Gallium Arsenide Substrate, 6”, Prime Grade

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