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Ultrasonic soldering bonds glass titanium stainless steel ceramics
Ultrasonic soldering can bond glass, titanium, stainless steel, and
ceramics. The principles and related information are as follows:
Principle of Ultrasonic Soldering
Vibration and Cavitation:Ultrasonic soldering uses ultrasonic
vibration. The transducer in the ultrasonic soldering equipment
converts electrical energy into mechanical vibration energy. When
high-frequency current passes through the transducer, the
piezoelectric crystal inside deforms and expands, generating
ultrasonic vibration. This vibration is transmitted to the solder
and the surface of the material to be welded through the welding
head. In the molten solder, ultrasonic vibration causes cavitation,
generating shock waves when bubbles burst. These shock waves remove
the oxide film on the surface of the molten solder and the dirt,
oil, and dust on the surface of the base material.
Chemical Reaction of Active Solder:Special active solders like
Cerasolzer are used in ultrasonic soldering. These solders contain
metals that easily combine with oxygen, such as zinc, titanium,
silicon, aluminum, and rare earth elements. During the soldering
process, these elements combine with oxygen in the air to form
oxides, which chemically bond with the oxide layers on the surfaces
of materials like glass, ceramics, and metals, achieving bonding.
Excellent Wetting Ability: It can significantly improve the wetting
effect of the solder on the workpiece surface. In conventional
soldering, it may be difficult to achieve good wetting on some
materials with poor solderability. However, the ultrasonic
soldering iron can overcome this problem, ensuring a more uniform
and complete solder joint.
High-Quality Solder Joints: By promoting better solder penetration
and adhesion, ultrasonic soldering helps to form solder joints with
higher strength and better electrical conductivity. This is
particularly important in applications where high reliability is
required, such as in the electronics industry for manufacturing
printed circuit boards.
Reduced Thermal Damage: Compared to traditional soldering methods
that rely mainly on high temperatures to melt the solder,
ultrasonic soldering can achieve good soldering results at
relatively lower temperatures. This helps to reduce the risk of
thermal damage to the workpiece, especially for heat-sensitive
components and materials.
Suitable for Various Materials: It can be used for soldering a wide
variety of materials, including some difficult-to-solder metals
like aluminum and copper. The ultrasonic vibrations can break down
the oxide layers on these materials, enabling successful soldering.
Applications
Electronics Manufacturing: It is widely used in the production of
printed circuit boards (PCBs), for soldering components such as
resistors, capacitors, integrated circuits, etc. onto the PCB. The
high precision and reliability of ultrasonic soldering ensure the
quality of electronic products.
Automobile Industry: In the manufacturing of automotive
electronics, such as the production of engine control units, power
electronics modules, and automotive wiring harnesses, ultrasonic
soldering is used to achieve reliable connections between different
components.
Aerospace and Defense: Due to its high reliability and ability to
handle high-performance materials, ultrasonic soldering is used in
the production of aerospace and defense electronics, where the
quality and reliability of solder joints are of utmost importance.
Jewelry Making: It is also employed in the jewelry industry for
soldering precious metals and gemstones. The precise control and
gentle soldering process of ultrasonic soldering help to avoid
damage to the delicate materials and ensure the quality of the
jewelry.
Structure
Ultrasonic Generator: This is the core component that generates
high-frequency electrical signals to drive the ultrasonic
transducer. It usually has functions such as frequency adjustment
and power control to adapt to different soldering requirements.
Ultrasonic Transducer: As mentioned earlier, it converts electrical
energy into mechanical vibrations. The transducer is typically made
of piezoelectric materials that exhibit the piezoelectric effect,
which means they can deform when an electric field is applied and
generate an electric field when deformed.
Soldering Iron Tip: The tip of the soldering iron is designed to
transmit the ultrasonic vibrations to the solder and workpiece. It
is usually made of heat-resistant and electrically conductive
materials such as copper or tungsten alloy. The shape and size of
the soldering iron tip can be customized according to different
soldering applications.
Handle and Cooling System: The handle of the ultrasonic soldering
iron is designed for easy operation and grip. It may also
incorporate a cooling system to prevent overheating of the
transducer and other components during operation. This is usually
achieved through air cooling or water cooling methods.
Application Examples
Electronics Manufacturing:In the production of electronic
components, it is used to solder electrodes on glass and ceramic
substrates, connect superconducting materials and components, and
bond leads in hybrid integrated circuits.
Optical Devices:It is used in the manufacturing of glass ornaments
and the metallization of optical glasses, such as bonding metal
hoops to optical glass fibers and sealing glass tubes.
Solar Energy Industry:It is used for the electrode wiring of solar
cell glass, simplifying the production process and reducing costs.