IOT Lead Free Through Hole PCB Assembly Services 1 Layer - 30 Layer
Brand Name:Linked
Certification:UL, ISO9001, TS16949
Model Number:LPCB1006
Minimum Order Quantity:1PCS
Delivery Time:10 working days
Payment Terms:T/T, Western Union, Paypal
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Location:
Shenzhen Guangdong China
Address:
326, Fuqi Commercial building, dahe industrial Zone, Guanlan , Longhua district, Shenzhen, GD
Supplier`s last login times:
within 34 hours
Product Details
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Product Details
IOT Lead Free PCB Board Assembly Through Hole Assembly 1 Layer - 30 Layer
Thank you for your interest.
Linked has been in PCB&PCBA manufacturing for more than 10 years, specializing in high-mix, quick turn around, small batches PCB and PCBA projects
Assembly Capability
| Item | Lot Size | ||||
| Normal | Special | Remark | |||
| PCB(used for SMT)spec | (L*W) | Min | L≥50mm | L＜50mm | Includes the Process Edge |
| W≥50mm | |||||
| Max | L≤460mm | L ＞ 460mm | |||
| W≤400mm | W＞ 400mm | ||||
| (Thickness) | Min thickness | 0.5mm | T＜0.5mm | ||
| Max thickness | 4.5mm | T＞4.5mm | |||
| SMT components spec. | dimension | Min size | 201 | 1005 | / |
| (0.6mm*0.3mm) | (0.3mm*0.2mm) | ||||
| Max size | 200mm*125mm | 200mm*125mm＜SMD | / | ||
| component thickness | T≤6.5mm | 6.5mm＜T≤15mm | / | ||
| QFP,SOP,SOJ(multipins) | Min pin space | 0.4mm | 0.3mm≤Pitch＜0.4mm | / | |
| CSP,BGA | Min ball space | 0.5mm | 0.3mm≤Pitch＜0.5mm | / | |
| Item | Prototype Manufacturer | ||||
| Normal | Special | Remark | |||
| SMT PCB SPEC | (L*W) | Min size | L≥50mm | L＜50mm | Includes the Process Edge |
| W≥30mm | |||||
| Max size | L≤450mm | L:800-450mm | |||
| W≤350mm | W:400-350mm | ||||
| (Thickness) | Minimum thickness | 0.8mm | T＜0.8mm | ||
| Maximum Thickness | 2mm | T＞2mm | |||
| DIP PCB SPEC | (L*W) | Min Size | L≥50mm | L＜50mm | |
| W≥30mm | |||||
| Max Size | L≤500mm | L≥500mm | |||
| W≤300mm | W≥300mm | ||||
| (Thickness) | Minimum Thickness | 0.8mm | T＜0.8mm | ||
| Maximum Thickness | 2mm | T＞2mm | |||
IOT Lead Free Through Hole PCB Assembly Services 1 Layer - 30 Layer
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