Precision Ultra Thin Diamond Wire For Semiconductor PV Silicon Wafer Slicing - huataolover

Precision Ultra Thin Diamond Wire For Semiconductor PV Silicon Wafer Slicing

Brand Name:HUATAO
Model Number:Ultra-Thin Diamond Wire
Minimum Order Quantity:50 KM
Delivery Time:7-10 Days
Payment Terms:L/C, T/T, Western Union, MoneyGram
Place of Origin:CHINA
Contact Now

Add to Cart

Verified Supplier
Location: Shijiazhuang Hebei China
Address: NO.298th of ZHONGHUA NORTH STREET,SHIJIAZHUANG CITY,CHINA.
Supplier`s last login times: within 22 hours
Product Details Company Profile
Product Details

Precision Ultra-Thin Diamond Wire For Semiconductor & PV Silicon Wafer Slicing


Description For Precision Ultra-Thin Diamond Wire For Semiconductor & PV Silicon Wafer Slicing:

Precision ultra-thin diamond wire is a cutting-edge cutting tool used in the semiconductor and photovoltaic (PV) industries for slicing silicon wafers with exceptional accuracy and minimal material loss. It consists of a high-tensile core wire (typically steel or tungsten) electroplated with diamond abrasive particles, enabling ultra-thin, high-efficiency slicing of monocrystalline and polycrystalline silicon ingots.


Features For Precision Ultra-Thin Diamond Wire For Semiconductor & PV Silicon Wafer Slicing:
1. Ultra-Thin Diameter: Ranges from 30–100 μm, enabling minimal kerf loss and higher wafer yield.
2. High Precision Cutting: Ensures uniform wafer thickness (as low as 100–200 μm) with superior surface quality.
3. Diamond Abrasives: Synthetic diamond particles (5–30 μm) provide exceptional hardness and wear resistance.
4. High Tensile Core: Steel or tungsten wire ensures durability and breakage resistance during high-speed cutting.
5. Low Wire Vibration: Enhances cutting stability, reducing wafer surface defects like micro-cracks.


Applications For Precision Ultra-Thin Diamond Wire For Semiconductor & PV Silicon Wafer Slicing:
1. Semiconductor Industry: Slicing silicon ingots into ultra-thin wafers for ICs, MEMS, and power devices. Enables thinner wafers for advanced packaging (e.g., 3D ICs).

2. Photovoltaic (PV) Solar Cells:Cutting monocrystalline and polycrystalline silicon ingots into wafers for high-efficiency solar panels. Reduces silicon waste, lowering production costs.

3. Advanced Materials Processing: Used for slicing brittle materials like sapphire, SiC, and glass.


Advantages For Precision Ultra-Thin Diamond Wire For Semiconductor & PV Silicon Wafer Slicing:
1. Higher Efficiency: Faster cutting speeds (up to 1.5–2.5 m/s) compared to slurry-based multi-wire sawing.
2. Lower Material Waste: Kerf loss reduced to ~100 μm (vs. 150–200 μm with slurry saws).
3. Eco-Friendly: Eliminates slurry waste, reducing environmental impact.
Cost-Effective: Longer wire lifespan and higher productivity lower overall manufacturing costs.


China Precision Ultra Thin Diamond Wire For Semiconductor PV Silicon Wafer Slicing supplier

Precision Ultra Thin Diamond Wire For Semiconductor PV Silicon Wafer Slicing

Inquiry Cart 0