Grinding Wheel For Semiconductor And Photoelectricity
Certification:High QC standard, 100% inspection
Minimum Order Quantity:1PC
Delivery Time:10-14 days delivery time
Payment Terms:T/T
Price:Negotiable
Supply Ability:20000 pcs per month capacity
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28-4#, China Germany Park, Xuedian Town, Xinzheng City
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Product Details
Resin Vitrified Bond Centerless Grinding Wheel Good Sharpness With
High Performance
Resin:
High efficiency grinding in one batch, good sharpness, long using life
Vitrified:
high efficiency and good shape retention
Centerless Grinding Wheels are made of grains of aluminum oxide and silicon carbide abrasive material, bonded together with vitrified, resin or rubber. Centerless Grinding Wheels are used on a wide variety of workpieces. They produce extremely close tolerances on metal cylindrical forms or parts.
Centreless grinding wheel is used for grinding cylindrical part out surface, supported without centres on a stationary work rest blade and moving between the grinding wheel and the regulating wheel.
Features:
Resin:
High efficiency grinding in one batch, good sharpness, long using life
Vitrified:
high efficiency and good shape retention
Specification:
| Common Shape | Wheel Size | Grit Size | Classic Specification |
| 1A1 | Resin Maximum OD is 750mm Vitrified OD:300mm~500mm | Resin the finest grit size is 3000 |
Application
| Industry | Workpiece&Material | Machine | Bond | Working Data |
| Semiconductor and Photovoltaic industries | Ceramic, magnet, sapphire | Resin Vitrified |
For any inquire, quality feedback or technical question, there always be a professional responding answered by our technician team within 24 hours.
Grinding Wheel For Semiconductor And Photoelectricity
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