Metal & Resin Bond Dicing Saw Blade , High Precision Diamond Dicing Blades
Certification:High QC standard, 100% inspection
Minimum Order Quantity:1PC
Delivery Time:15-20 days delivery time
Payment Terms:T/T
Price:Negotiable
Supply Ability:20000 pcs per month capacity
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28-4#, China Germany Park, Xuedian Town, Xinzheng City
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Product Details
Metal & Resin Bond Dicing Blade
Ultra thin dicing blades are widely used in semiconducto industry
Features:
- Metal bond can hold grit size strongly
- high precision
- good shape holding
- good wear resistant and long using life
Specification:
| Specifications: | Application | |||||||
| Common Shape | Wheel Size | Grit Size | Classic Specification | Industry | Workpiece&Material | Machine | Bond | Working Data |
| 1A8, 1A1R | OD:10-200 T:0.07-2.0 H:6, 8, 12.7, 31.75,50.8 | 3um-70um | semiconductor industry optical glass industry optical communication | BGA, LGA, LED Blue glass, crystal, gem, filter quartz | Resin Metal | |||
Metal & Resin Bond Dicing Saw Blade , High Precision Diamond Dicing Blades
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