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Higher Density Tungsten Copper Alloy Round Bar WCu Rod 2021
Higher Density Tungsten Copper Alloy Round Bar WCu Rod 2021 has a wide range of uses, mainly used to make the contacts of high-voltage electrical switches that resist arc ablation, rocket nozzle throat linings, tail rudders and other high-temperature components, as well as electrodes for electrical machining, high-temperature molds and other Applications requiring electrical and thermal conductivity and high-temperature use.
1. Military high temperature resistant materials
Tungsten copper alloy is used in aerospace for missiles, rocket
engine nozzles, gas rudders, air rudders, and nose cones. The main
requirements are high temperature resistance (3000K~5000K) and high
temperature resistance to air erosion. Copper is mainly used at
high temperatures. The sweat cooling effect formed by
volatilization (the melting point of copper is 1083°C), reduces the
surface temperature of tungsten and copper, and ensures the use
under high temperature conditions.
2. Electrical alloy for high voltage switch
Tungsten copper alloy is widely used in high-voltage switch 128kV
SF6 circuit breaker WCu/CuCr, and high-voltage vacuum load switch
(12kV 40.5KV 1000A), lightning arrester, high-voltage vacuum switch
is small in size, easy to maintain, and has a wide range of
applications. Use in flammable, explosive and corrosive
environments. The main performance requirements are arc ablation
resistance, fusion welding resistance, low cut-off current, low gas
content, and low thermionic emission capability. In addition to the
conventional macro performance requirements, porosity and
microstructure performance are also required. Therefore, special
processes are required, and complex processes such as vacuum
degassing and vacuum infiltration are required.
Tungsten Copper Alloy Round Bar Chemical Composition :
Code No. | Chemical Composition % | Mechanical properties | ||||||
CU | Impurity | W | Density (g/cm3 ) | Hardness HB | RES( cm) | Conductivity IACS/ % | TRS/ Mpa | |
CuW(50) | 50±2.0 | 0.5 | Balance | 11.85 | 115 | 3.2 | 54 | |
CuW(55) | 45± 2.0 | 0.5 | Balance | 12.30 | 125 | 3.5 | 49 | |
CuW(60) | 40±2.0 | 0.5 | Balance | 12.75 | 140 | 3.7 | 47 | |
CuW(65) | 35±2.0 | 0.5 | Balance | 13.30 | 155 | 3.9 | 44 | |
CuW(70) | 30±2.0 | 0.5 | Balance | 13.80 | 175 | 4.1 | 42 | 790 |
CuW(75) | 25±2.0 | 0.5 | Balance | 14.50 | 195 | 4.5 | 38 | 885 |
CuW(80) | 20±2.0 | 0.5 | Balance | 15.15 | 220 | 5.0 | 34 | 980 |
CuW(85) | 15±2.0 | 0.5 | Balance | 15.90 | 240 | 5.7 | 30 | 1080 |
CuW(90) | 10±2.0 | 0.5 | Balance | 16.75 | 260 | 6.5 | 27 | 1160 |
Three, electrical machining electrode
Early EDM electrodes used copper or graphite electrodes, which were
cheap but not resistant to ablation. Now they have basically been
replaced by tungsten copper electrodes. The advantages of tungsten
copper electrode are high temperature resistance, high temperature
strength, arc ablation resistance, good electrical and thermal
conductivity, and fast heat dissipation. Applications are
concentrated in electric spark electrodes, resistance welding
electrodes and high-voltage discharge tube electrodes.
Electro-processing electrodes are characterized by a wide range of
varieties and specifications, small batches and large totals. The
tungsten copper material used as the electrode for
electro-processing should have the highest possible density and
uniformity of the structure, especially the elongated rod-shaped,
tubular and special-shaped electrodes.
Four, microelectronic materials
Tungsten copper electronic packaging and heat sink materials have
both the low expansion characteristics of tungsten and the high
thermal conductivity of copper. Its thermal expansion coefficient
and thermal conductivity can be changed by adjusting the
composition of tungsten copper, thus providing more tungsten
copper. Wide range of applications. Because tungsten copper
material has high heat resistance and good thermal conductivity,
and at the same time, it has a thermal expansion coefficient that
matches with silicon wafers, gallium arsenide and ceramic
materials, so it is widely used in semiconductor materials.
Suitable for use with high-power device packaging materials, heat
sink materials, heat dissipation components, ceramics and gallium
arsenide