High Purity 99.5% Titanium Sputtering Target For Pvd Coating System
Brand Name:JINXING
Certification:ISO 9001
Model Number:Titanium Sputtering Target
Minimum Order Quantity:1kg
Delivery Time:10～25 work days
Payment Terms:L/C, D/A, D/P, T/T, Western Union
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Titanium Sputtering Target 99.5%, 99.95% D100x40mm , D65x6.35mm
Purity is the main performance index of the target material, because the purity of the target material has a great influence on the performance of the film.
Main performance requirements of target material:
Purity is the main performance index of the target material,
because the purity of the target material has a great influence on
the performance of the film. However, in practical application, the
purity requirements of the target are not the same. For example,
with the rapid development of microelectronics industry, the size
of silicon chip has been developed from 6 ", 8" to 12 ", while the
wiring width has been reduced from 0.5um to 0.25um, 0.18um or even
0.13um. Previously, 99.995% of the target purity can meet the
process requirements of 0.35um IC, while the preparation of 0.18um
line requires 99.999% or even 99.9999% of the target purity.
Impurities in the target solid and oxygen and water vapor in the pores are the main pollution sources. Different target materials have different requirements for different impurity content. For example, pure aluminum and aluminum alloy targets for semiconductor industry have different requirements for alkali metal content and radioactive element content.
In order to reduce the porosity in the target solid and improve the
properties of sputtered films, the target is usually required to
have a high density. The density of the target not only affects the
sputtering rate, but also affects the electrical and optical
properties of the film. The higher the target density is, the
better the film performance is. In addition, increasing the density
and strength of the target can make the target better withstand the
thermal stress in the sputtering process. Density is also the key
performance index of the target.
Generally, the target material is polycrystalline structure, and
the grain size can be from micrometer to millimeter. For the same
kind of target, the sputtering rate of the target with small grain
size is faster than that of the target with large grain size, while
the thickness distribution of the film deposited by the target with
small grain size difference (uniform distribution) is more uniform.
Titanium Sputtering Target , Titanium Sputtering Target 99.95%
are available in varying sizes
D100x40mm , D65x6.35mm etc
| Product Name | Element | Purirty | Melting Point ℃ | Density (g/cc) | Available Shapes |
| High Pure Sliver | Ag | 4N-5N | 961 | 10.49 | Wire, Sheet, Particle, Target |
| High Pure Aluminum | Al | 4N-6N | 660 | 2.7 | Wire, Sheet, Particle, Target |
| High Pure Gold | Au | 4N-5N | 1062 | 19.32 | Wire, Sheet, Particle, Target |
| High Pure Bismuth | Bi | 5N-6N | 271.4 | 9.79 | Particle, Target |
| High Pure Cadmium | Cd | 5N-7N | 321.1 | 8.65 | Particle, Target |
| High Pure Cobalt | Co | 4N | 1495 | 8.9 | Particle, Target |
| High Pure Chromium | Cr | 3N-4N | 1890 | 7.2 | Particle, Target |
| High Pure Copper | Cu | 3N-6N | 1083 | 8.92 | Wire, Sheet, Particle, Target |
| High Pure Ferro | Fe | 3N-4N | 1535 | 7.86 | Particle, Target |
| High Pure Germanium | Ge | 5N-6N | 937 | 5.35 | Particle, Target |
| High Pure Indium | In | 5N-6N | 157 | 7.3 | Particle, Target |
| High Pure Magnesium | Mg | 4N | 651 | 1.74 | Wire, Particle, Target |
| High Pure Magnesium | Mn | 3N | 1244 | 7.2 | Wire, Particle, Target |
| High Pure Molybdenum | Mo | 4N | 2617 | 10.22 | Wire, Sheet, Particle, Target |
| High Pure Niobium | Nb | 4N | 2468 | 8.55 | Wire, Target |
| High Pure Nickel | Ni | 3N-5N | 1453 | 8.9 | Wire, Sheet, Particle, Target |
| High Pure Lead | Pb | 4N-6N | 328 | 11.34 | Particle, Target |
| High Pure Palladium | Pd | 3N-4N | 1555 | 12.02 | Wire, Sheet, Particle, Target |
| High Pure Platinum | Pt | 3N-4N | 1774 | 21.5 | Wire, Sheet, Particle, Target |
| High Pure Silicon | Si | 5N-7N | 1410 | 2.42 | Particle, Target |
| High Pure Tin | Sn | 5N-6N | 232 | 7.75 | Wire, Particle, Target |
| High Pure Tantalum | Ta | 4N | 2996 | 16.6 | Wire, Sheet, Particle, Target |
| High Pure Tellurium | Te | 4N-6N | 425 | 6.25 | Particle, Target |
| High Pure Titanium | Ti | 4N-5N | 1675 | 4.5 | Wire, Particle, Target |
| High Pure Tungsten | W | 3N5-4N | 3410 | 19.3 | Wire, Sheet, Particle, Target |
| High Pure Zinc | Zn | 4N-6N | 419 | 7.14 | Wire, Sheet, Particle, Target |
| High Pure Zirconium | Zr | 4N | 1477 | 6.4 | Wire, Sheet, Particle, Target |
High Purity 99.5% Titanium Sputtering Target For Pvd Coating System
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