Name: Titanium Plate Sputtering Targets High Purity For Semiconductor Chips
Brand: JINXING
Price: 20 USD

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Titanium Plate Sputtering Targets High Purity For Semiconductor Chips

Brand Name:JINXING

Certification:ISO 9001

Model Number:Titanium Sputtering Target

Minimum Order Quantity:1kg

Delivery Time:10～25 work days

Payment Terms:L/C, D/A, D/P, T/T, Western Union

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JINXING MATECH CO LTD

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Address: NO.57 KEXUEDADAO ROAD

Supplier`s last login times: within 14 hours

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Product Details Company Profile

Product Details

Titanium Plate Sputtering Target high purity 99.99%, 99.999%

High purity material, ultra-high purity material, semiconductor high purity material

Products include low oxygen ultra-high purity titanium material, high-end titanium alloy material, production equipment and process development of low oxygen ultra-fine (spherical) Ti powder and Ti alloy powder, advanced metal pressure processing technology, process development of low-cost Ti, near net forming processing technology (additive manufacturing, precision casting). It is widely used in the purification and preparation of ultra-high purity metal materials for semiconductors, the preparation and processing of high-end titanium alloys for aviation, offshore oil, green energy, medical devices and other fields.

Titanium is widely used in various fields of modern industry because of its superior comprehensive properties. However, titanium with ordinary purity is far from meeting the most advanced technical requirements in the core strategic fields such as semiconductor integrated circuit, aerospace, military industry, medical treatment, petrochemical industry, etc. From 99.98% to 99.999%, although there is only a little bit in the number, it has made a qualitative leap. Only ultra-high pure titanium can meet the raw material requirements of many modern industries and advanced processing technologies, such as sputtering target materials for semiconductor chips, high-end titanium alloy for aerospace, high-end titanium powder for 3D printing, etc

Titanium Plate Sputtering Target 99.99% , Titanium Plate Sputtering Target 99.999% are available in varying sizes

Product Name	Element	Purirty	Melting Point ℃	Density (g/cc)	Available Shapes
High Pure Sliver	Ag	4N-5N	961	10.49	Wire, Sheet, Particle, Target
High Pure Aluminum	Al	4N-6N	660	2.7	Wire, Sheet, Particle, Target
High Pure Gold	Au	4N-5N	1062	19.32	Wire, Sheet, Particle, Target
High Pure Bismuth	Bi	5N-6N	271.4	9.79	Particle, Target
High Pure Cadmium	Cd	5N-7N	321.1	8.65	Particle, Target
High Pure Cobalt	Co	4N	1495	8.9	Particle, Target
High Pure Chromium	Cr	3N-4N	1890	7.2	Particle, Target
High Pure Copper	Cu	3N-6N	1083	8.92	Wire, Sheet, Particle, Target
High Pure Ferro	Fe	3N-4N	1535	7.86	Particle, Target
High Pure Germanium	Ge	5N-6N	937	5.35	Particle, Target
High Pure Indium	In	5N-6N	157	7.3	Particle, Target
High Pure Magnesium	Mg	4N	651	1.74	Wire, Particle, Target
High Pure Magnesium	Mn	3N	1244	7.2	Wire, Particle, Target
High Pure Molybdenum	Mo	4N	2617	10.22	Wire, Sheet, Particle, Target
High Pure Niobium	Nb	4N	2468	8.55	Wire, Target
High Pure Nickel	Ni	3N-5N	1453	8.9	Wire, Sheet, Particle, Target
High Pure Lead	Pb	4N-6N	328	11.34	Particle, Target
High Pure Palladium	Pd	3N-4N	1555	12.02	Wire, Sheet, Particle, Target
High Pure Platinum	Pt	3N-4N	1774	21.5	Wire, Sheet, Particle, Target
High Pure Silicon	Si	5N-7N	1410	2.42	Particle, Target
High Pure Tin	Sn	5N-6N	232	7.75	Wire, Particle, Target
High Pure Tantalum	Ta	4N	2996	16.6	Wire, Sheet, Particle, Target
High Pure Tellurium	Te	4N-6N	425	6.25	Particle, Target
High Pure Titanium	Ti	4N-5N	1675	4.5	Wire, Particle, Target
High Pure Tungsten	W	3N5-4N	3410	19.3	Wire, Sheet, Particle, Target
High Pure Zinc	Zn	4N-6N	419	7.14	Wire, Sheet, Particle, Target
High Pure Zirconium	Zr	4N	1477	6.4	Wire, Sheet, Particle, Target

Application field of sputtering coating: Sputtering coating is widely used in packaging coating, decoration coating, architectural glass coating, automobile glass coating, low radiation glass coating, flat panel display, optical communication / optical industry, optical data storage industry, optical data storage industry, magnetic data storage industry, optical coating, semiconductor field, automation, solar energy, medical treatment, self lubrication film, capacitor Device coating, other functional coating, etc. (click to enter the detailed introduction)

Sputtering target backplane supply, bonding service: the center provides a variety of sputtering target backplane, including oxygen-free copper, molybdenum, aluminum, stainless steel and other materials. At the same time, it provides the welding service between the target and the back plate.

Company Profile

JINXING MATECH is a research and development, production, processing and sales of integrated, comprehensive refractory metal, precious metal material manufacturer.JINXING MATECH is an expert provider on the metal solution. Especially on the products such as Tungsten , Tungsten copper , Titanium , Zirconium, Vanadium, Hafnium, Sputtering Target , Nickel base alloy, Cobalt base alloys etc, products quality supplied according to ASTM , ASME , AMS , MIL , ISO , DIN and EN Standard which mainly used in Semiconductor, Petro-Chemical, Solor , Medical , Aerospace, Military industries.

So far JINXING MATECH's has attracted more than 50 countries customers in We mainly supply to the Market such as Canada, Sweden, Italy, Denmark, India, New Zealand , Mexico, South Korea , Netherland , Australia , India and Southeast Asia coutries sand many other countries and regions by reliable qualities, professional service and cost effective pricing. JINXING MATECH's production and inspection equipments include 100tons Hydraulic press, 20 tons Automation Controls Press, Vacuum Pressure Sintering Furnace , Electro-sparking wire cut machine ,powder metal Mixer, Granulation Drum, Hydrogen Sintering Furnace, Rochwell and Brinell hardness meters ,Metallocope , carbon and oxygen analyser etc.. JINXING MATECH's has 8,000 square meters construction area as well as two workshops ,JINXING MATECH people keep improving products quality and inspect the density, hardness and composition of finished products strictly, which ensures every product meets customers' requirements.

Technology Process

Strong manufacturing capabilities along with a full-scale R&D and test lab give us the ability to fully control all process of raw materials preparing, manufacturing, inspection, packing and delivery.

Our success is built on long-standing customer relationships, the quality of our sputtering targets and the level of technical and logistic services and sensitivity to economic, political and environmental issues. Within our organization, we are continually challenging our own performance.

All of our core technical team members have more than 10 years professional experience of both R&D and high volume manufacturing. Our business operations and logistics team is staffed with experienced professionals to provide friendly and timely support and services to our customers.

Quality Assurance

Special Metals Fabrication is an ISO 9001: 2015 accredited company. Our attitude to quality assurance means we are continually striving to improve our company and to ensure we are working to the highest possible standards.

Quality is a big part of every day at Special Metals Fabrication. Each service we offer has its own team of experts, making sure everything we offer complies within the standards we have set.

Product Tags:

icp metal analysis ic on alumina substrate can tempered glass be etched

Titanium Plate Sputtering Targets High Purity For Semiconductor Chips

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